Kuei-Li HUANG

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding through multi-shot laser reflow
- Patent number 12,040,309
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,464
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure including a thermal isolation material
- Patent number 11,776,945
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 11,749,535
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding through multi-shot laser reflow
- Patent number 11,462,507
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 11,158,605
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structures and methods for forming the same
- Patent number 11,101,261
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,069,671
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods for semiconductor devices comprising forming tren...
- Patent number 10,832,999
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding through multi-shot laser reflow
- Patent number 10,790,261
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace packaging structure and method for forming the same
- Patent number 10,600,709
- Issue date Mar 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods for semiconductor devices including forming trenc...
- Patent number 10,522,452
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package structure including a thermal isolation material...
- Patent number 10,490,539
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system of device-to-device tunnel establishment between...
- Patent number 10,425,251
- Issue date Sep 24, 2019
- Wistron NeWeb Corporation
- Chui-Chu Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package-on-package structures and methods for forming the same
- Patent number 10,373,941
- Issue date Aug 6, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package structure with epoxy flux residue
- Patent number 10,297,579
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-to-device wireless communication method, device and system f...
- Patent number 10,271,262
- Issue date Apr 23, 2019
- Industrial Technology Research Institute
- Kuei-Li Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Bump-on-trace packaging structure and method for forming the same
- Patent number 10,192,804
- Issue date Jan 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 10,153,180
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package process for applying molding compound
- Patent number 10,134,703
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 10,109,612
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interference coordination, network server and communicat...
- Patent number 10,028,273
- Issue date Jul 17, 2018
- Industrial Technology Research Institute
- Chun-Chieh Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Cell and method and system for bandwidth management of backhaul net...
- Patent number 9,974,052
- Issue date May 15, 2018
- Industrial Technology Research Institute
- Chun-Chieh Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package-on-package structures and methods for forming the same
- Patent number 9,935,091
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure with epoxy flux residue
- Patent number 9,881,903
- Issue date Jan 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment in the packaging of integrated circuits
- Patent number 9,865,574
- Issue date Jan 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 9,799,631
- Issue date Oct 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...
- Publication number 20240395767
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING THROUGH MULTI-SHOT LASER REFLOW
- Publication number 20240234365
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES
- Publication number 20240203971
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturning Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure Including a Thermal Isolation Material
- Publication number 20230378153
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230307404
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Through Multi-Shot Laser Reflow
- Publication number 20220367408
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20210351172
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Through Multi-Shot Laser Reflow
- Publication number 20210013173
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Methods for Semiconductor Devices
- Publication number 20200144171
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Structures and Methods
- Publication number 20200035510
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure Including a Thermal Isolation Material...
- Publication number 20200020677
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structures and Methods for Forming the Same
- Publication number 20190355710
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20190296002
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Through Multi-Shot Laser Reflow
- Publication number 20190279958
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
BUMP-ON-TRACE PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180337106
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Bonding Structures and Methods
- Publication number 20180330970
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structures and Methods for Forming the Same
- Publication number 20180197847
- Publication date Jul 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS COMMUNICATION METHOD, DEVICE AND SYSTEM
- Publication number 20180176849
- Publication date Jun 21, 2018
- Industrial Technology Research Institute
- Kuei-Li HUANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Package-on-Package Structure with Epoxy Flux Residue
- Publication number 20180166421
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Method
- Publication number 20180047708
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE WITH EPOXY FLUX RESIDUE
- Publication number 20170345794
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Method
- Publication number 20170179083
- Publication date Jun 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTERFERENCE COORDINATION, NETWORK SERVER AND COMMUNICAT...
- Publication number 20170150498
- Publication date May 25, 2017
- Industrial Technology Research Institute
- Chun-Chieh WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND SYSTEM OF DEVICE-TO-DEVICE TUNNEL ESTABLISHMENT BETWEEN...
- Publication number 20170111946
- Publication date Apr 20, 2017
- WISTRON NEWEB CORPORATION
- CHUI-CHU CHENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CELL AND METHOD AND SYSTEM FOR BANDWIDTH MANAGEMENT OF BACKHAUL NET...
- Publication number 20170064674
- Publication date Mar 2, 2017
- Industrial Technology Research Institute
- Chun-Chieh Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR DISTRIBUTED INTERFERENCE COORDINATION AND SMALL CELL USI...
- Publication number 20160373203
- Publication date Dec 22, 2016
- Industrial Technology Research Institute
- Chun-Chieh WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Package-on-Package Structures and Methods for Forming the Same
- Publication number 20160351554
- Publication date Dec 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structure Including a Thermal Isolation Material...
- Publication number 20160343698
- Publication date Nov 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS

Kuei-Li HUANG

Person

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Semiconductor bonding structures and methods

Bonding through multi-shot laser reflow

Semiconductor package and method

Package-on-package structure including a thermal isolation material

Semiconductor bonding structures and methods

Bonding through multi-shot laser reflow

System for processing semiconductor devices

Semiconductor packaging structure and method

Package-on-package structures and methods for forming the same

Semiconductor package and method

Packaging methods for semiconductor devices comprising forming tren...

Bonding through multi-shot laser reflow

Bump-on-trace packaging structure and method for forming the same

Packaging methods for semiconductor devices including forming trenc...

Package on-package structure including a thermal isolation material...

Method and system of device-to-device tunnel establishment between...

Package-on-package structures and methods for forming the same

Package on-package structure with epoxy flux residue

Device-to-device wireless communication method, device and system f...

Bump-on-trace packaging structure and method for forming the same

Semiconductor bonding structures and methods

Package on-package process for applying molding compound

Tools and systems for processing semiconductor devices, and methods...

Method for interference coordination, network server and communicat...

Cell and method and system for bandwidth management of backhaul net...

Package-on-package structures and methods for forming the same

Package-on-package structure with epoxy flux residue

Alignment in the packaging of integrated circuits

Semiconductor packaging structure and method

Patents Applicationslast 30 patents

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS...

BONDING THROUGH MULTI-SHOT LASER REFLOW

METHODS OF FORMING SEMICONDUCTOR PACKAGES

Package-on-Package Structure Including a Thermal Isolation Material

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Bonding Through Multi-Shot Laser Reflow

Tools and Systems for Processing Semiconductor Devices, and Methods...

Semiconductor Package and Method

Bonding Through Multi-Shot Laser Reflow

Packaging Methods for Semiconductor Devices

Semiconductor Bonding Structures and Methods

Package-on-Package Structure Including a Thermal Isolation Material...

Package-on-Package Structures and Methods for Forming the Same

Semiconductor Package and Method

Bonding Through Multi-Shot Laser Reflow

Tools and Systems for Processing Semiconductor Devices, and Methods...

BUMP-ON-TRACE PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor Bonding Structures and Methods

Package-on-Package Structures and Methods for Forming the Same

WIRELESS COMMUNICATION METHOD, DEVICE AND SYSTEM

Package-on-Package Structure with Epoxy Flux Residue

Semiconductor Packaging Structure and Method

PACKAGE-ON-PACKAGE STRUCTURE WITH EPOXY FLUX RESIDUE

Semiconductor Packaging Structure and Method

METHOD FOR INTERFERENCE COORDINATION, NETWORK SERVER AND COMMUNICAT...

METHOD AND SYSTEM OF DEVICE-TO-DEVICE TUNNEL ESTABLISHMENT BETWEEN...

CELL AND METHOD AND SYSTEM FOR BANDWIDTH MANAGEMENT OF BACKHAUL NET...

METHOD FOR DISTRIBUTED INTERFERENCE COORDINATION AND SMALL CELL USI...

Package-on-Package Structures and Methods for Forming the Same

Package-on-Package Structure Including a Thermal Isolation Material...