Kuei Pin WAN

Follow

Person

Miao-Li, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging method and structure thereof
- Patent number 8,420,523
- Issue date Apr 16, 2013
- Kun Yuan Technology Co., Ltd.
- Cheng-Ho Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING METHOD AND STRUCTURE THEREOF
- Publication number 20120070943
- Publication date Mar 22, 2012
- Kun Yuan Technology Co., Ltd.
- Cheng-Ho HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip packaging method and structure thereof
- Publication number 20100314748
- Publication date Dec 16, 2010
- Kun Yuan Technology Co., Ltd.
- Cheng-Ho HSU
- H01 - BASIC ELECTRIC ELEMENTS