Kuei-Ti Chan

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Inner spacer for semiconductor device
- Patent number 12,283,618
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fu-Ting Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with TSV inductor
- Patent number 11,715,754
- Issue date Aug 1, 2023
- Mediatek Inc.
- Zheng Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly with through silicon via interconnect
- Patent number 9,947,624
- Issue date Apr 17, 2018
- Mediatek Inc.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly with through silicon via interconnect
- Patent number 9,570,399
- Issue date Feb 14, 2017
- Mediatek Inc.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,548,271
- Issue date Jan 17, 2017
- Mediatek Inc.
- Kuei-Ti Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,209,148
- Issue date Dec 8, 2015
- Mediatek Inc.
- Kuei-Ti Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,987,897
- Issue date Mar 24, 2015
- Mediatek Inc.
- Kuei-Ti Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated inductor
- Patent number 8,860,544
- Issue date Oct 14, 2014
- MediaTek Inc.
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING...
- Publication number 20250226359
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250126870
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250081492
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Lin CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363744
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Ting YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM-TOP SEAL FOR DIELECTRICS
- Publication number 20230395683
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Lin CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNER SPACER FOR SEMICONDUCTOR DEVICE
- Publication number 20230326988
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Ting YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE
- Publication number 20220416011
- Publication date Dec 29, 2022
- MEDIATEK SINGAPORE PTE LTD
- Chang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220216154
- Publication date Jul 7, 2022
- MEDIATEK SINGAPORE PTE LTD
- Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TSV INDUCTOR
- Publication number 20210384291
- Publication date Dec 9, 2021
- MEDIATEK INC.
- Zheng Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH THROUGH SILICON VIA INTERCONNECT
- Publication number 20170110406
- Publication date Apr 20, 2017
- MEDIATEK INC.
- Ming-Tzong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH THROUGH SILICON VIA INTERCONNECT
- Publication number 20160181201
- Publication date Jun 23, 2016
- MEDIATEK INC.
- Ming-Tzong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160056105
- Publication date Feb 25, 2016
- MEDIATEK INC.
- Kuei-Ti Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150194403
- Publication date Jul 9, 2015
- MEDIATEK INC.
- Kuei-Ti Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE STRUCTURE WITH LOW CROSSTALK
- Publication number 20130002375
- Publication date Jan 3, 2013
- MEDIATEK INC.
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20120126368
- Publication date May 24, 2012
- MEDIATEK INC.
- Kuei-Ti Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OXIDE DEFINE PATTERN
- Publication number 20110133308
- Publication date Jun 9, 2011
- Kuei-Ti Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OXIDE DEFINE DUMMY FEATURE
- Publication number 20100295150
- Publication date Nov 25, 2010
- Kuei-Ti Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR
- Publication number 20090261937
- Publication date Oct 22, 2009
- Ching-Chung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR
- Publication number 20090002114
- Publication date Jan 1, 2009
- Ming-Tzong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOS CAPACITOR WITH LARGE CONSTANT VALUE
- Publication number 20080284495
- Publication date Nov 20, 2008
- MEDIATEK INC.
- Kuei-ti Chan
- H01 - BASIC ELECTRIC ELEMENTS

Kuei-Ti Chan

Person

Patents Grantslast 30 patents

Inner spacer for semiconductor device

Semiconductor package with TSV inductor

Semiconductor package assembly with through silicon via interconnect

Semiconductor package assembly with through silicon via interconnect

Semiconductor package

Semiconductor package

Semiconductor package

Integrated inductor

Patents Applicationslast 30 patents

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEAM-TOP SEAL FOR DIELECTRICS

INNER SPACER FOR SEMICONDUCTOR DEVICE

CAPACITOR STRUCTURE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE WITH TSV INDUCTOR

SEMICONDUCTOR PACKAGE ASSEMBLY WITH THROUGH SILICON VIA INTERCONNECT

SEMICONDUCTOR PACKAGE ASSEMBLY WITH THROUGH SILICON VIA INTERCONNECT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

TRANSMISSION LINE STRUCTURE WITH LOW CROSSTALK

Semiconductor Package

SEMICONDUCTOR DEVICE WITH OXIDE DEFINE PATTERN

SEMICONDUCTOR DEVICE WITH OXIDE DEFINE DUMMY FEATURE

INTEGRATED INDUCTOR

INTEGRATED INDUCTOR

MOS CAPACITOR WITH LARGE CONSTANT VALUE