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Kuei-Wu Chu

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  • Taoyuan County, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Easily stackable dies
    • Patent number 8,424,357
    • Issue date Apr 23, 2013
    • Aflash Technology Co., Ltd.
    • Leo Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer-bump structure
    • Patent number 8,299,629
    • Issue date Oct 30, 2012
    • Aflash Technology Co., Ltd.
    • Kuei-Wu Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Flash memory
    • Patent number 8,184,464
    • Issue date May 22, 2012
    • Aflash Technology, Co., Ltd.
    • Kuei-Wu Chu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTROLESS NICKEL BUMP OF DIE PAD AND MANUFACTURING METHOD THEREOF
    • Publication number 20150235978
    • Publication date Aug 20, 2015
    • AFLASH TECHNOLOGY CO., LTD.
    • Ta-Lun Sung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-Layered Circuit Board Device
    • Publication number 20120181065
    • Publication date Jul 19, 2012
    • MAO BANG ELECTRONIC CO., LTD.
    • Kuei-Wu Chu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit Board Packaged with Die through Surface Mount Technology
    • Publication number 20120074558
    • Publication date Mar 29, 2012
    • MAO BANG ELECTRONIC CO., LTD.
    • Hsuan Yu LU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wafer-Bump Structure
    • Publication number 20110260300
    • Publication date Oct 27, 2011
    • MAO BANG ELECTRONIC CO., LTD.
    • Kuei-Wu Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Integrated Circuit
    • Publication number 20110108983
    • Publication date May 12, 2011
    • MAO BANG ELECTRONIC CO., LTD.
    • Leo Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip for Reliable Stacking on another Chip
    • Publication number 20110062586
    • Publication date Mar 17, 2011
    • MAO BANG ELECTRONIC CO., LTD.
    • Leo Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip Stacking Device Having Re-Distribution Layer
    • Publication number 20110062590
    • Publication date Mar 17, 2011
    • MAO BANG ELECTRONIC CO., LTD.
    • Leo Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Easily Stackable Dies
    • Publication number 20110023574
    • Publication date Feb 3, 2011
    • MAO BANG ELECTRONIC CO., LTD.
    • Leo Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Flash memory
    • Publication number 20110019457
    • Publication date Jan 27, 2011
    • MAO BANG ELECTRONIC CO., LTD.
    • Kuei-Wu Chu
    • H01 - BASIC ELECTRIC ELEMENTS