Kuei-Yuam Hsu

Follow

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method to prevent passivation layer peeling in a solder bump format...
- Patent number 6,951,803
- Issue date Oct 4, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE BOARD
- Publication number 20140134424
- Publication date May 15, 2014
- KUEI HAO HSU
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD TO PREVENT PASSIVATION LAYER PEELING IN A SOLDER BUMP FORMAT...
- Publication number 20050191836
- Publication date Sep 1, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS