Kui Kam Lam

Person

Hong Kong, HK

People

Patents Grantslast 30 patents

Information Patent Grant
Direct transfer apparatus for electronic components
- Patent number 11,136,202
- Issue date Oct 5, 2021
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Collet inspection in a semiconductor pick and place apparatus
- Patent number 11,056,377
- Issue date Jul 6, 2021
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
System for adjusting relative positions between components of a bon...
- Patent number 10,882,298
- Issue date Jan 5, 2021
- ASM Technology Singapore Pte. Ltd.
- Shui Cheung Woo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Die attachment apparatus and method utilizing activated forming gas
- Patent number 10,399,170
- Issue date Sep 3, 2019
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method of determining a bonding position of a die
- Patent number 10,311,597
- Issue date Jun 4, 2019
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pick and place device comprising pick arm correction module
- Patent number 10,014,203
- Issue date Jul 3, 2018
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- G05 - CONTROLLING REGULATING
Information Patent Grant
Apparatus for testing multiple semiconductor dice with increased th...
- Patent number 9,989,587
- Issue date Jun 5, 2018
- ASM Technology Singapore Pte. Ltd.
- Yam Mo Wong
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for locating a plurality of placement position...
- Patent number 8,804,136
- Issue date Aug 12, 2014
- ASM Technology Singapore Pte. Ltd.
- Kui Kam Lam
- G01 - MEASURING TESTING
Information Patent Grant
Die bonder incorporating dual-head dispenser
- Patent number 7,977,231
- Issue date Jul 12, 2011
- ASM Assembly Automation Ltd.
- Kui Kam Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispensing solder for mounting semiconductor chips
- Patent number 7,735,715
- Issue date Jun 15, 2010
- ASM Assembly Automation LTD
- Kui Kam Lam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for die attachment
- Patent number 6,991,967
- Issue date Jan 31, 2006
- ASM Assembly Automation Ltd.
- Deming Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT TRANSFER APPARATUS FOR ELECTRONIC COMPONENTS
- Publication number 20210206585
- Publication date Jul 8, 2021
- ASM Technology Singapore Pte Ltd
- Kui Kam LAM
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
COLLET INSPECTION IN A SEMICONDUCTOR PICK AND PLACE APPARATUS
- Publication number 20210005498
- Publication date Jan 7, 2021
- ASM Technology Singapore Pte Ltd
- Kui Kam LAM
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
APPARATUS AND METHOD OF DETERMINING A BONDING POSITION OF A DIE
- Publication number 20180350097
- Publication date Dec 6, 2018
- ASM Technology Singapore Pte Ltd
- Kui Kam LAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM FOR ADJUSTING RELATIVE POSITIONS BETWEEN COMPONENTS OF A BON...
- Publication number 20180126718
- Publication date May 10, 2018
- ASM Technology Singapore Pte Ltd
- Shui Cheung WOO
- B32 - LAYERED PRODUCTS
Information Patent Application
PICK AND PLACE DEVICE COMPRISING PICK ARM CORRECTION MODULE
- Publication number 20170236734
- Publication date Aug 17, 2017
- ASM Technology Singapore Pte Ltd
- Kui Kam LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TESTING MULTIPLE SEMICONDUCTOR DICE WITH INCREASED TH...
- Publication number 20160334464
- Publication date Nov 17, 2016
- ASM Technology Singapore Pte Ltd
- Yam Mo WONG
- G01 - MEASURING TESTING
Information Patent Application
DIE ATTACHMENT APPARATUS AND METHOD UTILIZING ACTIVATED FORMING GAS
- Publication number 20150072473
- Publication date Mar 12, 2015
- Kui Kam LAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS HAVING A PLURALITY OF ROTARY TRANSFER ARMS FOR TR...
- Publication number 20140341691
- Publication date Nov 20, 2014
- Kui Kam LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR LOCATING A PLURALITY OF PLACEMENT POSITION...
- Publication number 20140160492
- Publication date Jun 12, 2014
- Kui Kam LAM
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR FABRICATING A LIGHT-EMITTING DIODE PACKAGE
- Publication number 20130178002
- Publication date Jul 11, 2013
- ASM Technology Singapore Pte Ltd
- Kui Kam LAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS...
- Publication number 20130119113
- Publication date May 16, 2013
- ASM Assembly Automation Ltd
- Kui Kam LAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DIE BONDING ONTO DISPENSED ADHESIVES
- Publication number 20120094440
- Publication date Apr 19, 2012
- Kwok Kee CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS...
- Publication number 20110272452
- Publication date Nov 10, 2011
- Kui Kam Lam
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPENSING SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS
- Publication number 20090145950
- Publication date Jun 11, 2009
- Kui Kam LAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for die attachment
- Publication number 20050186019
- Publication date Aug 25, 2005
- ASM Assembly Automation Ltd
- Deming Liu
- H01 - BASIC ELECTRIC ELEMENTS

Kui Kam Lam

Person

Patents Grantslast 30 patents

Direct transfer apparatus for electronic components

Collet inspection in a semiconductor pick and place apparatus

System for adjusting relative positions between components of a bon...

Die attachment apparatus and method utilizing activated forming gas

Apparatus and method of determining a bonding position of a die

Pick and place device comprising pick arm correction module

Apparatus for testing multiple semiconductor dice with increased th...

Apparatus and method for locating a plurality of placement position...

Die bonder incorporating dual-head dispenser

Dispensing solder for mounting semiconductor chips

Apparatus and method for die attachment

Patents Applicationslast 30 patents

DIRECT TRANSFER APPARATUS FOR ELECTRONIC COMPONENTS

COLLET INSPECTION IN A SEMICONDUCTOR PICK AND PLACE APPARATUS

APPARATUS AND METHOD OF DETERMINING A BONDING POSITION OF A DIE

SYSTEM FOR ADJUSTING RELATIVE POSITIONS BETWEEN COMPONENTS OF A BON...

PICK AND PLACE DEVICE COMPRISING PICK ARM CORRECTION MODULE

APPARATUS FOR TESTING MULTIPLE SEMICONDUCTOR DICE WITH INCREASED TH...

DIE ATTACHMENT APPARATUS AND METHOD UTILIZING ACTIVATED FORMING GAS

BONDING APPARATUS HAVING A PLURALITY OF ROTARY TRANSFER ARMS FOR TR...

APPARATUS AND METHOD FOR LOCATING A PLURALITY OF PLACEMENT POSITION...

METHOD AND APPARATUS FOR FABRICATING A LIGHT-EMITTING DIODE PACKAGE

SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS...

METHOD OF DIE BONDING ONTO DISPENSED ADHESIVES

SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS...

DISPENSING SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS

Apparatus and method for die attachment