Kuk Hwea Yi

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method for separating sapphire wafer into chips
- Patent number 7,074,652
- Issue date Jul 11, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Goo Yoon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for separating sapphire wafer into chips
- Publication number 20050079687
- Publication date Apr 14, 2005
- Samsung Electro-Mechanics CO., LTD.
- Jeong Goo Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for cutting semiconductor wafer using laser scribing process
- Publication number 20040198024
- Publication date Oct 7, 2004
- Samsung Electro-Mechanics CO., LTD.
- Jeong Goo Yoon
- H01 - BASIC ELECTRIC ELEMENTS