Kuldeep Saxena

Person

Wexford, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged electronic devices having dielectric substrates with therm...
- Patent number 12,224,233
- Issue date Feb 11, 2025
- Wolfspeed, Inc.
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with improved performance
- Patent number 12,199,045
- Issue date Jan 14, 2025
- Wolfspeed, Inc.
- Guy Moxey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrugated package for microelectromechanical system (MEMS) device
- Patent number 10,442,683
- Issue date Oct 15, 2019
- Akustica, Inc.
- Kuldeep Saxena
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package with molded spacer
- Patent number 9,894,444
- Issue date Feb 13, 2018
- Robert Bosch GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded interconnect mircoelectromechanical system (MEMS) device pac...
- Patent number 9,781,519
- Issue date Oct 3, 2017
- Akustica, Inc.
- Kuldeep Saxena
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package with molded spacer
- Patent number 9,661,421
- Issue date May 23, 2017
- Robert Bosch GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Power Semiconductor Package
- Publication number 20240304507
- Publication date Sep 12, 2024
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Enhanced Power Semiconductor Package
- Publication number 20240243031
- Publication date Jul 18, 2024
- Wolfspeed, Inc.
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP SIDE COOLED SEMICONDUCTOR PACKAGES
- Publication number 20230420329
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Adil Salman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES HAVING DIELECTRIC SUBSTRATES WITH THERM...
- Publication number 20220238426
- Publication date Jul 28, 2022
- Cree, Inc.
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE WITH IMPROVED PERFORMANCE
- Publication number 20210305166
- Publication date Sep 30, 2021
- Cree, Inc.
- Guy Moxey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Corrugated Package for Microelectromechanical System (MEMS) Device
- Publication number 20170297905
- Publication date Oct 19, 2017
- Akustica, Inc.
- Kuldeep Saxena
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE PACKAGE WITH MOLDED SPACER
- Publication number 20170303049
- Publication date Oct 19, 2017
- ROBERT BOSCH GmbH
- Jay Scott Salmon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Molded Interconnect Mircoelectromechanical System (MEMS) Device Pac...
- Publication number 20160234604
- Publication date Aug 11, 2016
- Akustica, Inc.
- Kuldeep Saxena
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE PACKAGE WITH MOLDED SPACER
- Publication number 20160127838
- Publication date May 5, 2016
- ROBERT BOSCH GmbH
- Jay Scott Salmon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Kuldeep Saxena

Person

Patents Grantslast 30 patents

Packaged electronic devices having dielectric substrates with therm...

Power semiconductor package with improved performance

Corrugated package for microelectromechanical system (MEMS) device

Microphone package with molded spacer

Molded interconnect mircoelectromechanical system (MEMS) device pac...

Microphone package with molded spacer

Patents Applicationslast 30 patents

Power Semiconductor Package

Thermal Enhanced Power Semiconductor Package

TOP SIDE COOLED SEMICONDUCTOR PACKAGES

PACKAGED ELECTRONIC DEVICES HAVING DIELECTRIC SUBSTRATES WITH THERM...

POWER SEMICONDUCTOR PACKAGE WITH IMPROVED PERFORMANCE

Corrugated Package for Microelectromechanical System (MEMS) Device

MICROPHONE PACKAGE WITH MOLDED SPACER

Molded Interconnect Mircoelectromechanical System (MEMS) Device Pac...

MICROPHONE PACKAGE WITH MOLDED SPACER