KULJEET SINGH

Person

ORANGEVALE, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic assembly having a more dense arrangement of contacts tha...
- Patent number 7,282,796
- Issue date Oct 16, 2007
- Intel Corporation
- Kuljeet Singh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for a dual substrate package
- Patent number 7,247,517
- Issue date Jul 24, 2007
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having select spacing of rows and columns of co...
- Patent number 7,064,431
- Issue date Jun 20, 2006
- Intel Corporation
- Kuljeet Singh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly having a more dense arrangement of contacts tha...
- Patent number 6,885,102
- Issue date Apr 26, 2005
- Intel Corporation
- Kuljeet Singh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of dissipating static electric charge from a chip assembly d...
- Patent number 6,764,877
- Issue date Jul 20, 2004
- Intel Corporation
- Arthur K. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bond process flow for copper metal-six, structures achieved th...
- Patent number 6,715,663
- Issue date Apr 6, 2004
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding of package substrates
- Patent number 6,566,741
- Issue date May 20, 2003
- Intel Corporation
- Arthur K. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic ball grid array package with improved moisture resistance
- Patent number 6,404,067
- Issue date Jun 11, 2002
- Intel Corporation
- Kuljeet Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic assembly having a more dense arrangement of contacts tha...
- Publication number 20050090125
- Publication date Apr 28, 2005
- Kuljeet Singh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic assembly having a more dense arrangement of contacts tha...
- Publication number 20050087858
- Publication date Apr 28, 2005
- Kuljeet Singh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and apparatus for a dual substrate package
- Publication number 20050067714
- Publication date Mar 31, 2005
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bond process flow for copper metal-six, structures achieved th...
- Publication number 20040192019
- Publication date Sep 30, 2004
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly having a more dense arrangement of contacts tha...
- Publication number 20040036176
- Publication date Feb 26, 2004
- Kuljeet Singh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Grounding of package substrates
- Publication number 20030137038
- Publication date Jul 24, 2003
- Arthur K. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bond process flow for copper metal-six, structures achieved th...
- Publication number 20030132766
- Publication date Jul 17, 2003
- Intel Corporation
- Krishna Seshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING OF PACKAGE SUBSTRATES
- Publication number 20020105064
- Publication date Aug 8, 2002
- ARTHUR K. LIN
- H01 - BASIC ELECTRIC ELEMENTS

KULJEET SINGH

Person

Patents Grantslast 30 patents

Electronic assembly having a more dense arrangement of contacts tha...

Method and apparatus for a dual substrate package

Electronic assembly having select spacing of rows and columns of co...

Electronic assembly having a more dense arrangement of contacts tha...

Method of dissipating static electric charge from a chip assembly d...

Wire-bond process flow for copper metal-six, structures achieved th...

Grounding of package substrates

Plastic ball grid array package with improved moisture resistance

Patents Applicationslast 30 patents

Electronic assembly having a more dense arrangement of contacts tha...

Electronic assembly having a more dense arrangement of contacts tha...

Method and apparatus for a dual substrate package

Wire-bond process flow for copper metal-six, structures achieved th...

Electronic assembly having a more dense arrangement of contacts tha...

Grounding of package substrates

Wire-bond process flow for copper metal-six, structures achieved th...

GROUNDING OF PACKAGE SUBSTRATES