Kum Foo Leong

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Kodah, MY

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Patents Grantslast 30 patents

Information Patent Grant
Solder interface locking using unidirectional growth of an intermet...
- Patent number 7,701,069
- Issue date Apr 20, 2010
- Intel Corporation
- Kum Foo Leong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stitched micro-via to enhance adhesion and mechanical strength
- Patent number 7,692,301
- Issue date Apr 6, 2010
- Intel Corporation
- Kum Foo Leong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stitched micro-via to enhance adhesion and mechanical strength
- Patent number 7,229,913
- Issue date Jun 12, 2007
- Intel Corporation
- Kum Foo Leong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for interconnecting components to via-in-pad...
- Patent number 6,828,512
- Issue date Dec 7, 2004
- Intel Corporation
- C. Key Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STITCHED MICRO-VIA TO ENHANCE ADHESION AND MECHANICAL STRENGTH
- Publication number 20070222058
- Publication date Sep 27, 2007
- Intel Corporation
- Kum Foo Leong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stitched micro-via to enhance adhesion and mechanical strength
- Publication number 20050067679
- Publication date Mar 31, 2005
- Intel Corporation
- Kum Foo Leong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Diffusion barrier layer for lead free package substrate
- Publication number 20050067699
- Publication date Mar 31, 2005
- Intel Corporation
- Kum Foo Leong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder interface locking using unidirectional growth of an intermet...
- Publication number 20050012216
- Publication date Jan 20, 2005
- Intel Corporation
- Kum Foo Leong
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus and methods for interconnecting components to via-in-pad...
- Publication number 20040064942
- Publication date Apr 8, 2004
- C. Key Chung
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...