Kum-weng Loo

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with thermal heat spreader
- Patent number 8,338,943
- Issue date Dec 25, 2012
- STMicroelectronics Asia Pacific PTE Ltd.
- Kum Weng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a stiffening member supporting a thermal...
- Patent number 8,013,438
- Issue date Sep 6, 2011
- STMicroelectronics Asia Pacific PTE Ltd.
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with position member
- Patent number 7,919,361
- Issue date Apr 5, 2011
- STMicroelectronics Asia Pacific PTE Ltd.
- Kum-weng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cap including a housing and optically transparent member to protect...
- Patent number 7,880,132
- Issue date Feb 1, 2011
- STMicroelectronics (Research & Development) Limited
- Stuart Brodie
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Simplified multichip packaging and package design
- Patent number 7,816,182
- Issue date Oct 19, 2010
- STMicroelectronics Asia Pacific PTE Ltd.
- Kum-Weng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with position member
- Patent number 7,745,945
- Issue date Jun 29, 2010
- STMicroelectronics Asia Pacific PTE Ltd.
- Kum-weng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fixing a lens of an optic group with respect to an optic...
- Patent number 7,061,697
- Issue date Jun 13, 2006
- STMicroelectronics S.A.
- Pierangelo Magni
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 7,056,765
- Issue date Jun 6, 2006
- STMicroelectronics Asia Pacific PTE Ltd.
- Kum-Weng Loo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL HEAT SPREADER
- Publication number 20120050996
- Publication date Mar 1, 2012
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kum Weng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A STIFFENING MEMBER SUPPORTING A THERMAL...
- Publication number 20110018125
- Publication date Jan 27, 2011
- STMicroelectronics Asia Pacific PTE LTD (Singapore)
- Kum-Weng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Simplified multichip packaging and package design
- Publication number 20110006411
- Publication date Jan 13, 2011
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kum-Weng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with position member
- Publication number 20100297813
- Publication date Nov 25, 2010
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kum-weng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE LENS CAP
- Publication number 20090057544
- Publication date Mar 5, 2009
- STMicroelectronics (Research & Development) Limited
- Stuart Brodie
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor package with position member
- Publication number 20070085177
- Publication date Apr 19, 2007
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kum-weng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Simplified multichip packaging and package design
- Publication number 20060113643
- Publication date Jun 1, 2006
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kum-Weng Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fixing a lens of an optic group with respect to an optic...
- Publication number 20050046973
- Publication date Mar 3, 2005
- STMicroelectronics S.A.
- Pierangelo Magni
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor device package and method of manufacture
- Publication number 20040159927
- Publication date Aug 19, 2004
- STMicroelectronics Asia Pacific Pte. Ltd.
- Kum-Weng Loo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Kum-weng Loo

Person

Patents Grantslast 30 patents

Semiconductor package with thermal heat spreader

Semiconductor package with a stiffening member supporting a thermal...

Semiconductor package with position member

Cap including a housing and optically transparent member to protect...

Simplified multichip packaging and package design

Semiconductor package with position member

Method for fixing a lens of an optic group with respect to an optic...

Semiconductor device package and method of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH THERMAL HEAT SPREADER

SEMICONDUCTOR PACKAGE WITH A STIFFENING MEMBER SUPPORTING A THERMAL...

Simplified multichip packaging and package design

Semiconductor package with position member

CAMERA MODULE LENS CAP

Semiconductor package with position member

Simplified multichip packaging and package design

Method for fixing a lens of an optic group with respect to an optic...

Semiconductor device package and method of manufacture