Kun-Chi Hsu

Person

Hukou Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging structure with back-deposited shielding lay...
- Patent number 11,658,046
- Issue date May 23, 2023
- Powertech Technology Inc.
- Shih-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier device
- Patent number 11,587,808
- Issue date Feb 21, 2023
- Powertech Technology Inc.
- Shih-Chun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package having partial outer metal layer and packagin...
- Patent number 11,410,945
- Issue date Aug 9, 2022
- Powertech Technology Inc.
- Shih-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method with full edge trimming
- Patent number 10,388,535
- Issue date Aug 20, 2019
- Powertech Technology Inc.
- Chui-Liang Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAD OF A CHIP PICKER
- Publication number 20220118631
- Publication date Apr 21, 2022
- Powertech Technology Inc.
- Wu-Yi CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER CUTTING METHOD FOR A WAFER
- Publication number 20210339338
- Publication date Nov 4, 2021
- Powertech Technology Inc.
- Chui-Liang CHIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PARTIAL OUTER METAL LAYER AND PACKAGIN...
- Publication number 20210288003
- Publication date Sep 16, 2021
- Powertech Technology Inc.
- Shih-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE WITH BACK-DEPOSITED SHIELDING LAY...
- Publication number 20210217632
- Publication date Jul 15, 2021
- Powertech Technology Inc.
- Shih-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER DEVICE
- Publication number 20210217641
- Publication date Jul 15, 2021
- Powertech Technology Inc.
- Shih-Chun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD
- Publication number 20190275600
- Publication date Sep 12, 2019
- Powertech Technology Inc.
- Kun-Chi Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD
- Publication number 20190267346
- Publication date Aug 29, 2019
- Powertech Technology Inc.
- Kun-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX TRANSFER METHOD
- Publication number 20190247944
- Publication date Aug 15, 2019
- Powertech Technology Inc.
- Kun-Chi Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER COLOR MARKING METHOD FOR A SEMICONDUCTOR PACKAGE
- Publication number 20190229064
- Publication date Jul 25, 2019
- Powertech Technology Inc.
- Chin-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS

Kun-Chi Hsu

Person

Patents Grantslast 30 patents

Semiconductor packaging structure with back-deposited shielding lay...

Chip carrier device

Semiconductor package having partial outer metal layer and packagin...

Wafer processing method with full edge trimming

Patents Applicationslast 30 patents

HEAD OF A CHIP PICKER

LASER CUTTING METHOD FOR A WAFER

SEMICONDUCTOR PACKAGE HAVING PARTIAL OUTER METAL LAYER AND PACKAGIN...

SEMICONDUCTOR PACKAGING STRUCTURE WITH BACK-DEPOSITED SHIELDING LAY...

CHIP CARRIER DEVICE

FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD

FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD

FLUX TRANSFER METHOD

LASER COLOR MARKING METHOD FOR A SEMICONDUCTOR PACKAGE