Kun-Dae Yeom

Person

Cheonan-city, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrate for a semiconductor package having landing pads e...
- Patent number 10,607,905
- Issue date Mar 31, 2020
- Samsung Electronics Co., Ltd.
- Baek Ki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including landing pads extending at an obliqu...
- Patent number 10,361,135
- Issue date Jul 23, 2019
- Samsung Electronics Co., Ltd.
- Baek Ki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including multiple chips and separate groups...
- Patent number 9,455,217
- Issue date Sep 27, 2016
- Samsung Electronics Co., Ltd.
- Chul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array package capable of decreasing a height difference b...
- Patent number 9,041,181
- Issue date May 26, 2015
- Samsung Electronics Co., Ltd.
- Hee-chul Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package including multiple chips and separate groups...
- Patent number 8,901,750
- Issue date Dec 2, 2014
- Samsung Electronics Co., Ltd.
- Chul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including multiple chips and separate groups...
- Patent number 8,723,333
- Issue date May 13, 2014
- Samsung Electronics Co., Ltd.
- Chul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density chip stacked package, package-on-package and method of...
- Patent number 8,664,757
- Issue date Mar 4, 2014
- Samsung Electronics Co., Ltd.
- Yun-Rae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including multiple chips and separate groups...
- Patent number 8,193,626
- Issue date Jun 5, 2012
- Samsung Electronics Co., Ltd.
- Chul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having reliable bump interconnection structur...
- Patent number 7,759,795
- Issue date Jul 20, 2010
- Samsung Electronics Co., Ltd.
- Young-Lyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package having dummy package substrate and method of fabricating th...
- Patent number 7,521,289
- Issue date Apr 21, 2009
- Samsung Electronics Co., Ltd.
- Young-min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit semiconductor chip and multi chip package with center bonding...
- Patent number 7,391,105
- Issue date Jun 24, 2008
- Samsung Electronics Co., Ltd.
- Kun-Dae Yeom
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE...
- Publication number 20180076105
- Publication date Mar 15, 2018
- Samsung Electronics Co., Ltd.
- Baek KI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MULTIPLE CHIPS AND SEPARATE GROUPS...
- Publication number 20150054144
- Publication date Feb 26, 2015
- Samsung Electronics Co., Ltd.
- Chul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Multiple Chips and Separate Groups...
- Publication number 20140225281
- Publication date Aug 14, 2014
- Samsung Electronics Co., Ltd.
- Chul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERPOSER COMPRISING A PLURALITY OF S...
- Publication number 20130161836
- Publication date Jun 27, 2013
- Samsung Electronics Co., Ltd.
- Kun-Dae YEOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Multiple Chips And Separate Groups...
- Publication number 20120217656
- Publication date Aug 30, 2012
- Chul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CHIP STACKED PACKAGE, PACKAGE-ON-PACKAGE AND METHOD OF...
- Publication number 20120007227
- Publication date Jan 12, 2012
- Samsung Electronics Co., Ltd.
- Yun-Rae CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110304056
- Publication date Dec 15, 2011
- Samsung Electronics Co., Ltd.
- Dong-hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY PACKAGE CAPABLE OF DECREASING A HEIGHT DIFFERENCE B...
- Publication number 20110198744
- Publication date Aug 18, 2011
- Hee-chul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, STACK MODULE, CARD, AND ELECTRONIC SYSTEM
- Publication number 20100314740
- Publication date Dec 16, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Keun-ho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20100117217
- Publication date May 13, 2010
- Chul Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME
- Publication number 20090057916
- Publication date Mar 5, 2009
- Samsung Electronics Co., Ltd.
- Kun-Dae YEOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAG...
- Publication number 20090026596
- Publication date Jan 29, 2009
- Samsung Electronics Co., Ltd.
- Sang-Wook PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages including thermal stress buffers and methods...
- Publication number 20080315379
- Publication date Dec 25, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Ku-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20080308913
- Publication date Dec 18, 2008
- Samsung Electronics Co., Ltd.
- Sang-Wook PARK
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of fabricating electronic device having sacrificial anode, a...
- Publication number 20080122081
- Publication date May 29, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Lyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD HAVING RELIABLE BUMP INTERCONNECTION STRUCTUR...
- Publication number 20080054462
- Publication date Mar 6, 2008
- Samsung Electronics Co., Ltd.
- Young-Lyong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stack type semiconductor package and method of fabricating the same
- Publication number 20080017968
- Publication date Jan 24, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Young-shin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package having dummy package substrate and method of fabricating th...
- Publication number 20060049501
- Publication date Mar 9, 2006
- Young-min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package having dummy package substrate and method of fabricating th...
- Publication number 20060050486
- Publication date Mar 9, 2006
- Young-min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Unit semiconductor chip and multi chip package with center bonding...
- Publication number 20050046006
- Publication date Mar 3, 2005
- Kun-Dae Yeom
- H01 - BASIC ELECTRIC ELEMENTS

Kun-Dae Yeom

Person

Patents Grantslast 30 patents

Package substrate for a semiconductor package having landing pads e...

Semiconductor package including landing pads extending at an obliqu...

Semiconductor package including multiple chips and separate groups...

Land grid array package capable of decreasing a height difference b...

Semiconductor package including multiple chips and separate groups...

Semiconductor package including multiple chips and separate groups...

High density chip stacked package, package-on-package and method of...

Semiconductor package including multiple chips and separate groups...

Printed circuit board having reliable bump interconnection structur...

Package having dummy package substrate and method of fabricating th...

Unit semiconductor chip and multi chip package with center bonding...

Patents Applicationslast 30 patents

PACKAGE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR PACKAGE INCLUDING MULTIPLE CHIPS AND SEPARATE GROUPS...

Semiconductor Package Including Multiple Chips and Separate Groups...

SEMICONDUCTOR PACKAGE HAVING INTERPOSER COMPRISING A PLURALITY OF S...

Semiconductor Package Including Multiple Chips And Separate Groups...

HIGH DENSITY CHIP STACKED PACKAGE, PACKAGE-ON-PACKAGE AND METHOD OF...

STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

LAND GRID ARRAY PACKAGE CAPABLE OF DECREASING A HEIGHT DIFFERENCE B...

SEMICONDUCTOR PACKAGE, STACK MODULE, CARD, AND ELECTRONIC SYSTEM

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME

LEAD FRAME, SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAG...

Semiconductor packages including thermal stress buffers and methods...

STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Method of fabricating electronic device having sacrificial anode, a...

PRINTED CIRCUIT BOARD HAVING RELIABLE BUMP INTERCONNECTION STRUCTUR...

Stack type semiconductor package and method of fabricating the same

Package having dummy package substrate and method of fabricating th...

Package having dummy package substrate and method of fabricating th...

Unit semiconductor chip and multi chip package with center bonding...