Kun Fang

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package comprising a substrate with high density interconnects
- Patent number 12,125,742
- Issue date Oct 22, 2024
- QUALCOMM Incorporated
- Hyunchul Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-directional antenna modules employing a surface-mount antenna...
- Patent number 12,126,071
- Issue date Oct 22, 2024
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate with a via interconnect coupled to a...
- Patent number 11,869,833
- Issue date Jan 9, 2024
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a substrate comprising pad-on-pad interconnects
- Patent number 11,823,983
- Issue date Nov 21, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects embedded in a solder resist layer
- Patent number 11,551,939
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects embedded in a solder resist layer
- Patent number 11,545,425
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with substrate comprising variable thickness solder resist...
- Patent number 11,439,008
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X.5 layer substrate
- Patent number 11,183,446
- Issue date Nov 23, 2021
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA MODULES EMPLOYING A PACKAGE SUBSTRATE WITH A VERTICALLY-INT...
- Publication number 20230307817
- Publication date Sep 28, 2023
- QUALCOMM Incorporated
- Suhyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIRECTIONAL ANTENNA MODULES EMPLOYING A SURFACE-MOUNT ANTENNA...
- Publication number 20230282959
- Publication date Sep 7, 2023
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH HIGH DENSITY INTERCONNECTS
- Publication number 20230093681
- Publication date Mar 23, 2023
- QUALCOMM Incorporated
- Hyunchul Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A VIA INTERCONNECT COUPLED TO A...
- Publication number 20230078231
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE EMPLOYING INTEGRATED SLOT-SHAPED ANTENNA(S), AND...
- Publication number 20230014567
- Publication date Jan 19, 2023
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING PAD-ON-PAD INTERCONNECTS
- Publication number 20220310488
- Publication date Sep 29, 2022
- QUALCOMM Incorporated
- Kun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER
- Publication number 20220115312
- Publication date Apr 14, 2022
- QUALCOMM Incorporated
- Kun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER
- Publication number 20220068662
- Publication date Mar 3, 2022
- QUALCOMM Incorporated
- Kun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SUBSTRATE COMPRISING VARIABLE THICKNESS SOLDER RESIST...
- Publication number 20220053639
- Publication date Feb 17, 2022
- QUALCOMM Incorporated
- Kun FANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package comprising a substrate with high density interconnects

Multi-directional antenna modules employing a surface-mount antenna...

Package comprising a substrate with a via interconnect coupled to a...

Package with a substrate comprising pad-on-pad interconnects

Substrate comprising interconnects embedded in a solder resist layer

Substrate comprising interconnects embedded in a solder resist layer

Package with substrate comprising variable thickness solder resist...

X.5 layer substrate

Patents Applicationslast 30 patents

ANTENNA MODULES EMPLOYING A PACKAGE SUBSTRATE WITH A VERTICALLY-INT...

MULTI-DIRECTIONAL ANTENNA MODULES EMPLOYING A SURFACE-MOUNT ANTENNA...

PACKAGE COMPRISING A SUBSTRATE WITH HIGH DENSITY INTERCONNECTS

PACKAGE COMPRISING A SUBSTRATE WITH A VIA INTERCONNECT COUPLED TO A...

PACKAGE SUBSTRATE EMPLOYING INTEGRATED SLOT-SHAPED ANTENNA(S), AND...

PACKAGE WITH A SUBSTRATE COMPRISING PAD-ON-PAD INTERCONNECTS

SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER

SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER

PACKAGE WITH SUBSTRATE COMPRISING VARIABLE THICKNESS SOLDER RESIST...