Kun Mo Chu

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation material and light emitting diode package includin...
- Patent number 9,516,739
- Issue date Dec 6, 2016
- Samsung Electronics Co., Ltd.
- Eun Sung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating member and fusing apparatus including the same
- Patent number 9,501,013
- Issue date Nov 22, 2016
- Samsung Electronics Co., Ltd.
- Sang-eui Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Heating composite, and heating apparatus and fusing apparatus inclu...
- Patent number 9,348,280
- Issue date May 24, 2016
- Samsung Electronics Co., Ltd.
- Sang-Eui Lee
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Resistance heating composition, heating composite using the composi...
- Patent number 9,272,902
- Issue date Mar 1, 2016
- Samsung Electronics Co., Ltd.
- Dong-ouk Kim
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Resistance heating element and heating member and fusing device emp...
- Patent number 9,165,701
- Issue date Oct 20, 2015
- Samsung Electronics Co., Ltd.
- Kun-mo Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating member including a base polymer and fusing apparatus includ...
- Patent number 9,052,655
- Issue date Jun 9, 2015
- Samsung Electronics Co., Ltd.
- Yoon-chul Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming thin resistive heating layer, heating member incl...
- Patent number 9,037,063
- Issue date May 19, 2015
- Samsung Electronics Co., Ltd.
- Sang-eui Lee
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Heat dissipation material and light emitting diode package includin...
- Patent number 9,000,473
- Issue date Apr 7, 2015
- Samsung Electronics Co., Ltd.
- Eun Sung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating member and fusing device including the same
- Patent number 9,002,253
- Issue date Apr 7, 2015
- Samsung Electronics Co., Ltd.
- Yoon-chul Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDIN...
- Publication number 20150069455
- Publication date Mar 12, 2015
- Eun Sung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-BASED SOLDER COMPOSITE INCLUDING CONDUCTIVE SELF-HEALING MATE...
- Publication number 20140299231
- Publication date Oct 9, 2014
- Samsung Electronics Co., Ltd.
- Kun-mo CHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESISTANCE HEATING ELEMENT AND HEATING MEMBER AND FUSING DEVICE EMP...
- Publication number 20140205336
- Publication date Jul 24, 2014
- Samsung Electronics Co., Ltd.
- Kun-mo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING MEMBER AND FUSING DEVICE INCLUDING THE SAME
- Publication number 20140126940
- Publication date May 8, 2014
- Samsung Electronics Co., Ltd.
- Yoon-chul SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUSING APPARATUS AND METHOD
- Publication number 20140072353
- Publication date Mar 13, 2014
- Samsung Electronics Co., Ltd.
- Dong-earn KIM
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF FORMING THIN RESISTIVE HEATING LAYER, HEATING MEMBER INCL...
- Publication number 20140053393
- Publication date Feb 27, 2014
- Samsung Electronics Co., Ltd.
- Sang-eui LEE
- B82 - NANO-TECHNOLOGY
Information Patent Application
HEATING MEMBER AND FUSING APPARATUS INCLUDING THE SAME
- Publication number 20130302074
- Publication date Nov 14, 2013
- Samsung Electronics Co., Ltd.
- Sang-eui LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
HEATING MEMBER AND FUSING APPARATUS INCLUDING THE SAME
- Publication number 20130251425
- Publication date Sep 26, 2013
- Samsung Electronics Co., Ltd.
- Yoon-chul SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESISTANCE HEATING COMPOSITION, HEATING COMPOSITE USING THE COMPOSI...
- Publication number 20130222510
- Publication date Aug 29, 2013
- Samsung Electronics Co., Ltd.
- Dong-ouk KIM
- B82 - NANO-TECHNOLOGY
Information Patent Application
NANO COMPOSITE WITH SUPERHYDROPHOBIC SURFACE AND METHOD OF MANUFACT...
- Publication number 20130115420
- Publication date May 9, 2013
- Samsung Electronics Co., Ltd.
- Sung-hoon PARK
- B82 - NANO-TECHNOLOGY
Information Patent Application
HEATING COMPOSITE, AND HEATING APPARATUS AND FUSING APPARATUS INCLU...
- Publication number 20120294659
- Publication date Nov 22, 2012
- Samsung Electronics Co., Ltd.
- Sang-eui LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
RESISTANCE HEATING COMPOSITION AND HEATING COMPOSITE, HEATING APPAR...
- Publication number 20120207525
- Publication date Aug 16, 2012
- Samsung Electronics Co., Ltd.
- Dong-ouk KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE COATING LAYER AND HEAT EXCHANGER INCLUDING THE SURFACE COAT...
- Publication number 20120181004
- Publication date Jul 19, 2012
- Samsung Electronics Co., Ltd.
- Yoon Chul SON
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDIN...
- Publication number 20120056234
- Publication date Mar 8, 2012
- Samsung Electronics Co., Ltd.
- Eun Sung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Heat dissipation material and light emitting diode package includin...

Heating member and fusing apparatus including the same

Heating composite, and heating apparatus and fusing apparatus inclu...

Resistance heating composition, heating composite using the composi...

Resistance heating element and heating member and fusing device emp...

Heating member including a base polymer and fusing apparatus includ...

Method of forming thin resistive heating layer, heating member incl...

Heat dissipation material and light emitting diode package includin...

Heating member and fusing device including the same

Patents Applicationslast 30 patents

HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDIN...

METAL-BASED SOLDER COMPOSITE INCLUDING CONDUCTIVE SELF-HEALING MATE...

RESISTANCE HEATING ELEMENT AND HEATING MEMBER AND FUSING DEVICE EMP...

HEATING MEMBER AND FUSING DEVICE INCLUDING THE SAME

FUSING APPARATUS AND METHOD

METHOD OF FORMING THIN RESISTIVE HEATING LAYER, HEATING MEMBER INCL...

HEATING MEMBER AND FUSING APPARATUS INCLUDING THE SAME

HEATING MEMBER AND FUSING APPARATUS INCLUDING THE SAME

RESISTANCE HEATING COMPOSITION, HEATING COMPOSITE USING THE COMPOSI...

NANO COMPOSITE WITH SUPERHYDROPHOBIC SURFACE AND METHOD OF MANUFACT...

HEATING COMPOSITE, AND HEATING APPARATUS AND FUSING APPARATUS INCLU...

RESISTANCE HEATING COMPOSITION AND HEATING COMPOSITE, HEATING APPAR...

SURFACE COATING LAYER AND HEAT EXCHANGER INCLUDING THE SURFACE COAT...

HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDIN...