Kun RAN

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Shenzhen, CN

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Patents Grantslast 30 patents

Information Patent Grant
Photosensitive chip package structure, camera module, and mobile te...
- Patent number 11,869,908
- Issue date Jan 9, 2024
- HONOR DEVICE CO., LTD.
- Atsushi Yajima
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAMERA MODULE FOR IMPLEMENTING IMAGE STABILIZATION BY USING DISPLAC...
- Publication number 20240251167
- Publication date Jul 25, 2024
- HUAWEI TECHNOLOGIES CO., LTD.
- Cunying Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTOSENSITIVE CHIP PACKAGE STRUCTURE, CAMERA MODULE, AND MOBILE TE...
- Publication number 20210313366
- Publication date Oct 7, 2021
- Huawei Technologies Co., Ltd
- Atsushi YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA ASSEMBLY, ASSEMBLY METHOD, AND TERMINAL
- Publication number 20210075940
- Publication date Mar 11, 2021
- Huawei Technologies Co., Ltd
- Xi CAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE AND TERMINAL DEVICE
- Publication number 20190265461
- Publication date Aug 29, 2019
- Huawei Technologies Co., Ltd
- Zhenlin XIE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE