Membership
Tour
Register
Log in
Kun-Yi Liu
Follow
Person
Vancouver, WA, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Defect free deep trench method for semiconductor chip
Patent number
8,951,833
Issue date
Feb 10, 2015
Wafertech, LLC
Kun-Yi Liu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
DEFECT FREE DEEP TRENCH METHOD FOR SEMICONDUCTOR CHIP
Publication number
20120322259
Publication date
Dec 20, 2012
Kun-Yi Liu
B81 - MICRO-STRUCTURAL TECHNOLOGY