Kun Zhang

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Hangzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
System on wafer assembly structure and assembly method thereof
- Patent number 12,112,991
- Issue date Oct 8, 2024
- ZHEJIANG LAB
- Qingwen Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of system on wafer and PCB base on TSV pr...
- Patent number 11,705,437
- Issue date Jul 18, 2023
- ZHEJIANG LAB
- Qingwen Deng
- H01 - BASIC ELECTRIC ELEMENTS