Kunaljeet Tanwar

Person

Slingerlands, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integration of Ru wet etch and CMP for beol interconnects with Ru l...
- Patent number 9,558,997
- Issue date Jan 31, 2017
- GLOBALFOUNDRIES Inc.
- Kunaljeet Tanwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having self-repair Cu barrier for solving barrier degradatio...
- Patent number 9,343,406
- Issue date May 17, 2016
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture scavenging layer for thinner barrier application in beol i...
- Patent number 9,318,437
- Issue date Apr 19, 2016
- GLOBALFOUNDRIES Inc.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits having magnetic tunnel junctions (MTJ) and meth...
- Patent number 9,299,745
- Issue date Mar 29, 2016
- GLOBALFOUNDRIES, INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits using chemical mechanic...
- Patent number 9,275,874
- Issue date Mar 1, 2016
- GLOBALFOUNDRIES, INC.
- Kunaljeet Tanwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless fill of trench in semiconductor structure
- Patent number 9,087,881
- Issue date Jul 21, 2015
- GLOBALFOUNDRIES Inc.
- Sean X. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits using surface modificat...
- Patent number 9,076,846
- Issue date Jul 7, 2015
- GLOBALFOUNDRIES, INC.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for integration of pore stuffing material
- Patent number 9,054,052
- Issue date Jun 9, 2015
- Global Foundries Inc.
- Nicholas Vincent Licausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to use self-repair Cu barrier to solve barrier degradation d...
- Patent number 8,962,478
- Issue date Feb 24, 2015
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of self-forming barrier integration with pore stuffed ULK m...
- Patent number 8,932,934
- Issue date Jan 13, 2015
- Global Foundries Inc.
- Moosung M. Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive structures using a sacrificial materi...
- Patent number 8,883,631
- Issue date Nov 11, 2014
- GLOBALFOUNDRIES Inc.
- Kunaljeet Tanwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits having embedded electri...
- Patent number 8,835,306
- Issue date Sep 16, 2014
- GLOBALFOUNDRIES, INC.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL integration scheme for copper CMP to prevent dendrite formation
- Patent number 8,669,176
- Issue date Mar 11, 2014
- GLOBALFOUNDRIES Inc.
- Kunaljeet Tanwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits with ruthenium-lined co...
- Patent number 8,586,473
- Issue date Nov 19, 2013
- GLOBALFOUNDRIES, INC.
- Kunaljeet Tanwar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS HAVING MAGNETIC TUNNEL JUNCTIONS (MTJ) AND METH...
- Publication number 20150325622
- Publication date Nov 12, 2015
- GLOBALFOUNDRIES, Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO USE SELF-REPAIR CU BARRIER TO SOLVE BARRIER DEGRADATION D...
- Publication number 20150130063
- Publication date May 14, 2015
- GLOBALFOUNDRIES INC.
- Xunyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS USING SURFACE MODIFICAT...
- Publication number 20150126028
- Publication date May 7, 2015
- GLOBALFOUNDRIES, Inc.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS USING CHEMICAL MECHANIC...
- Publication number 20150064903
- Publication date Mar 5, 2015
- International Business Machines Corporation
- Kunaljeet Tanwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONDUCTIVE STRUCTURES USING A SACRIFICIAL MATERI...
- Publication number 20140357078
- Publication date Dec 4, 2014
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SEMICONDUCTOR CONTAMINANT REMOVAL USING SUPERCRITICAL FLUID
- Publication number 20140353805
- Publication date Dec 4, 2014
- GLOBALFOUNDRIES INC.
- Errol Todd RYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONDUCTIVE STRUCTURES USING A SACRIFICIAL MATERI...
- Publication number 20140357079
- Publication date Dec 4, 2014
- GLOBALFOUNDRIES INC.
- Kunaljeet Tanwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR INTEGRATION OF PORE STUFFING MATERIAL
- Publication number 20140353802
- Publication date Dec 4, 2014
- GLOBALFOUNDRIES INC.
- Nicholas Vincent LICAUSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELF-FORMING BARRIER INTEGRATION WITH PORE STUFFED ULK M...
- Publication number 20140353835
- Publication date Dec 4, 2014
- Moosung M. CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS FILL OF TRENCH IN SEMICONDUCTOR STRUCTURE
- Publication number 20140252616
- Publication date Sep 11, 2014
- Sean X. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS HAVING EMBEDDED ELECTRI...
- Publication number 20140220775
- Publication date Aug 7, 2014
- GLOBALFOUNDRIES, Inc.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF Ru WET ETCH AND CMP FOR BEOL INTERCONNECTS WITH Ru L...
- Publication number 20140187036
- Publication date Jul 3, 2014
- GLOBALFOUNDRIES INC.
- Kunaljeet Tanwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL INTEGRATION SCHEME FOR COPPER CMP TO PREVENT DENDRITE FORMATION
- Publication number 20140065815
- Publication date Mar 6, 2014
- GLOBALFOUNDRIES INC.
- Kunaljeet Tanwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A METAL CAP LAYER ON COPPER-BASED CONDUCTIVE STR...
- Publication number 20140057435
- Publication date Feb 27, 2014
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Kunaljeet Tanwar

Person

Patents Grantslast 30 patents

Integration of Ru wet etch and CMP for beol interconnects with Ru l...

Device having self-repair Cu barrier for solving barrier degradatio...

Moisture scavenging layer for thinner barrier application in beol i...

Integrated circuits having magnetic tunnel junctions (MTJ) and meth...

Methods for fabricating integrated circuits using chemical mechanic...

Electroless fill of trench in semiconductor structure

Methods for fabricating integrated circuits using surface modificat...

Methods for integration of pore stuffing material

Method to use self-repair Cu barrier to solve barrier degradation d...

Methods of self-forming barrier integration with pore stuffed ULK m...

Methods of forming conductive structures using a sacrificial materi...

Methods for fabricating integrated circuits having embedded electri...

BEOL integration scheme for copper CMP to prevent dendrite formation

Methods for fabricating integrated circuits with ruthenium-lined co...

Patents Applicationslast 30 patents

INTEGRATED CIRCUITS HAVING MAGNETIC TUNNEL JUNCTIONS (MTJ) AND METH...

METHOD TO USE SELF-REPAIR CU BARRIER TO SOLVE BARRIER DEGRADATION D...

METHODS FOR FABRICATING INTEGRATED CIRCUITS USING SURFACE MODIFICAT...

METHODS FOR FABRICATING INTEGRATED CIRCUITS USING CHEMICAL MECHANIC...

METHODS OF FORMING CONDUCTIVE STRUCTURES USING A SACRIFICIAL MATERI...

METHODS OF SEMICONDUCTOR CONTAMINANT REMOVAL USING SUPERCRITICAL FLUID

METHODS OF FORMING CONDUCTIVE STRUCTURES USING A SACRIFICIAL MATERI...

METHODS FOR INTEGRATION OF PORE STUFFING MATERIAL

METHODS OF SELF-FORMING BARRIER INTEGRATION WITH PORE STUFFED ULK M...

ELECTROLESS FILL OF TRENCH IN SEMICONDUCTOR STRUCTURE

METHODS FOR FABRICATING INTEGRATED CIRCUITS HAVING EMBEDDED ELECTRI...

INTEGRATION OF Ru WET ETCH AND CMP FOR BEOL INTERCONNECTS WITH Ru L...

BEOL INTEGRATION SCHEME FOR COPPER CMP TO PREVENT DENDRITE FORMATION

METHODS OF FORMING A METAL CAP LAYER ON COPPER-BASED CONDUCTIVE STR...