Kung-An Lin

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of measuring mask overlay using test patterns
- Patent number 12,271,116
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable pixel array substrate
- Patent number 12,230,645
- Issue date Feb 18, 2025
- Au Optronics Corporation
- Yun-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit overlay test patterns and method thereof
- Patent number 11,762,302
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Touch display device
- Patent number 11,264,447
- Issue date Mar 1, 2022
- Au Optronics Corporation
- Kung-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit overlay test patterns and method thereof
- Patent number 11,016,398
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device substrate
- Patent number 10,937,722
- Issue date Mar 2, 2021
- Au Optronics Corporation
- Ming-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film deposition apparatus having a peripheral spiral gas curtain
- Patent number 10,458,019
- Issue date Oct 29, 2019
- Industrial Technology Research Institute
- Ching-Chiun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 9,159,660
- Issue date Oct 13, 2015
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-mode thin film deposition apparatus and method of depositing...
- Patent number 9,023,693
- Issue date May 5, 2015
- Industrial Technology Research Institute
- Kung-Liang Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 8,658,466
- Issue date Feb 25, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRETCHABLE PIXEL ARRAY SUBSTRATE
- Publication number 20250142968
- Publication date May 1, 2025
- AUO Corporation
- Yun-Wen Pan
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194646
- Publication date Jun 13, 2024
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMP ASSEMBLY
- Publication number 20230420287
- Publication date Dec 28, 2023
- Chipbond Technology Corporation
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF
- Publication number 20230378044
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Overlay Test Patterns And Method Thereof
- Publication number 20230359131
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tseng Chin Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ARRAY SUBSTRATE
- Publication number 20230178527
- Publication date Jun 8, 2023
- AUO Corporation
- Kent-Yi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE PIXEL ARRAY SUBSTRATE
- Publication number 20220059577
- Publication date Feb 24, 2022
- AU OPTRONICS CORPORATION
- Yun-Wen Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Overlay Test Patterns and Method Thereof
- Publication number 20210278771
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tseng Chin Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOUCH DISPLAY DEVICE
- Publication number 20210028268
- Publication date Jan 28, 2021
- AU OPTRONICS CORPORATION
- Kung-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Overlay Test Patterns and Method Thereof
- Publication number 20190384185
- Publication date Dec 19, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Tseng Chin Lo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MULTI-MODE THIN FILM DEPOSITION APPARATUS AND METHOD OF DEPOSITING...
- Publication number 20150147890
- Publication date May 28, 2015
- Industrial Technology Research Institute
- Kung-Liang Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS SHOWER DEVICE HAVING GAS CURTAIN AND APPARATUS FOR DEPOSITING F...
- Publication number 20140123900
- Publication date May 8, 2014
- Industrial Technology Research Institute
- Ching-Chiun WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
- Publication number 20140117540
- Publication date May 1, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PAC...
- Publication number 20140120715
- Publication date May 1, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20140097540
- Publication date Apr 10, 2014
- Chipbond Technology Corporation
- Hsiang-Chin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
- Publication number 20140035126
- Publication date Feb 6, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PAC...
- Publication number 20140035125
- Publication date Feb 6, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20140027905
- Publication date Jan 30, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20130334681
- Publication date Dec 19, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Video Decoding Apparatus and Systems
- Publication number 20090086824
- Publication date Apr 2, 2009
- MEDIATEK INC.
- Kung-Sheng Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Apparatus and Method for Decoding Multimedia Content According to a...
- Publication number 20090086823
- Publication date Apr 2, 2009
- MEDIATEK INC.
- Kung-Sheng Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Kung-An Lin

Person

Patents Grantslast 30 patents

Method of measuring mask overlay using test patterns

Stretchable pixel array substrate

Integrated circuit overlay test patterns and method thereof

Touch display device

Integrated circuit overlay test patterns and method thereof

Device substrate

Film deposition apparatus having a peripheral spiral gas curtain

Semiconductor package structure and method for making the same

Multi-mode thin film deposition apparatus and method of depositing...

Semiconductor package structure and method for making the same

Patents Applicationslast 30 patents

STRETCHABLE PIXEL ARRAY SUBSTRATE

SEMICONDUCTOR PACKAGE

CLAMP ASSEMBLY

FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF

Integrated Circuit Overlay Test Patterns And Method Thereof

DEVICE ARRAY SUBSTRATE

STRETCHABLE PIXEL ARRAY SUBSTRATE

Integrated Circuit Overlay Test Patterns and Method Thereof

TOUCH DISPLAY DEVICE

Integrated Circuit Overlay Test Patterns and Method Thereof

MULTI-MODE THIN FILM DEPOSITION APPARATUS AND METHOD OF DEPOSITING...

GAS SHOWER DEVICE HAVING GAS CURTAIN AND APPARATUS FOR DEPOSITING F...

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF

SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PAC...

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF

SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PAC...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

Video Decoding Apparatus and Systems

Apparatus and Method for Decoding Multimedia Content According to a...