Kung-Chen Yeh

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Dummy die placement without backside chipping
- Patent number 11,990,429
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,948,896
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die placement without backside chipping
- Patent number 11,515,267
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 11,476,205
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,164,824
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 10,923,438
- Issue date Feb 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with dummy bump and method for forming the same
- Patent number 10,872,871
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die placement without backside chipping
- Patent number 10,861,799
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for dicing interposer assembly
- Patent number 10,269,731
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 9,793,187
- Issue date Oct 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for three dimensional integrated circuit
- Patent number 9,337,063
- Issue date May 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 9,111,912
- Issue date Aug 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for dicing interposer assembly
- Patent number 8,946,893
- Issue date Feb 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for three dimensional integrated circuit
- Patent number 8,772,929
- Issue date Jul 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for de-bonding carriers
- Patent number 8,629,043
- Issue date Jan 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for dicing interposer assembly
- Patent number 8,501,590
- Issue date Aug 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240203906
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Die Placement Without Backside Chipping
- Publication number 20230092361
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220359430
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210202436
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20210167024
- Publication date Jun 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Die Placement Without Backside Chipping
- Publication number 20210118817
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210066211
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Die Placement Without Backside Chipping
- Publication number 20200365525
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200343198
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY BUMP AND METHOD FOR FORMING THE SAME
- Publication number 20200203299
- Publication date Jun 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packages and Methods for Forming the Same
- Publication number 20150357255
- Publication date Dec 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Dicing Interposer Assembly
- Publication number 20150145133
- Publication date May 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packages and Methods for Forming the Same
- Publication number 20140353838
- Publication date Dec 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for Three Dimensional Integrated Circuit
- Publication number 20140322866
- Publication date Oct 30, 2014
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus For Dicing Interposer Assembly
- Publication number 20130285241
- Publication date Oct 31, 2013
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for De-Bonding Carriers
- Publication number 20130122689
- Publication date May 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for Three Dimensional Integrated Circuit
- Publication number 20130119533
- Publication date May 16, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for Dicing Interposer Assembly
- Publication number 20130009316
- Publication date Jan 10, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Kung-Chen Yeh

Person

Patents Grantslast 30 patents

Dummy die placement without backside chipping

Package structure

Dummy die placement without backside chipping

Package structure and method for forming the same

Package structure and method of fabricating the same

Package structure and method for forming the same

Chip package structure with dummy bump and method for forming the same

Dummy die placement without backside chipping

Apparatus for dicing interposer assembly

3D packages and methods for forming the same

Package for three dimensional integrated circuit

3D packages and methods for forming the same

Apparatus for dicing interposer assembly

Package for three dimensional integrated circuit

Methods for de-bonding carriers

Apparatus and methods for dicing interposer assembly

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Dummy Die Placement Without Backside Chipping

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

Dummy Die Placement Without Backside Chipping

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Dummy Die Placement Without Backside Chipping

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE STRUCTURE WITH DUMMY BUMP AND METHOD FOR FORMING THE SAME

3D Packages and Methods for Forming the Same

Apparatus for Dicing Interposer Assembly

3D Packages and Methods for Forming the Same

Package for Three Dimensional Integrated Circuit

Apparatus For Dicing Interposer Assembly

Methods for De-Bonding Carriers

Package for Three Dimensional Integrated Circuit

Apparatus and Methods for Dicing Interposer Assembly