Kung-Tzu Tu

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Kaohsiung City, TW

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Patents Applicationslast 30 patents

Information Patent Application
TEST PAD
- Publication number 20250220807
- Publication date Jul 3, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250159801
- Publication date May 15, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP STRUCTURE AND CIRCUIT BOARD THEREOF
- Publication number 20250157970
- Publication date May 15, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250071889
- Publication date Feb 27, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- G01 - MEASURING TESTING
Information Patent Application
THIN FILM CIRCUIT BOARD
- Publication number 20240389224
- Publication date Nov 21, 2024
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR