Kuniaki Maejima

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing composition for semiconductor wafer and polishing method
- Patent number 8,114,178
- Issue date Feb 14, 2012
- Nippon Chemical Industrial Co., Ltd.
- Masahiro Izumi
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing composition for semiconductor wafer, method for productio...
- Patent number 7,753,974
- Issue date Jul 13, 2010
- Nippon Chemical Industrial Co., Ltd.
- Shinsuke Miyabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preparing silicic acid hydrate
- Patent number 5,695,730
- Issue date Dec 9, 1997
- Nippon Paper Industries Co., Ltd.
- Kuniaki Maejima
- C01 - INORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
Polishing composition for semiconductor wafer
- Publication number 20100163786
- Publication date Jul 1, 2010
- Masahiro Izumi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Colloidal silica for semiconductor wafer polishing and production m...
- Publication number 20090267021
- Publication date Oct 29, 2009
- Masaru Nakajo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Colloidal silica consisting of silica particles fixing nitrogen con...
- Publication number 20090253813
- Publication date Oct 8, 2009
- Yuko Ishiguri
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Polishing compound for semiconductor wafer polishing and polishing...
- Publication number 20090223136
- Publication date Sep 10, 2009
- Nippon Chemical Industrial Co., Ltd. (50%)
- Masaru Nakajo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polishing composition for semiconductor wafer and polishing method
- Publication number 20080311750
- Publication date Dec 18, 2008
- NIPPON CHEMICAL INDUSTRIAL CO., LTD.
- Masahiro Izumi
- B24 - GRINDING POLISHING
Information Patent Application
Polishing composition for semiconductor wafer, method for productio...
- Publication number 20080287038
- Publication date Nov 20, 2008
- NIPPON CHEMICAL INDUSTRIAL CO., LTD.
- Shinsuke Miyabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Composition for polishing semiconductor wafer, and method of produc...
- Publication number 20080237535
- Publication date Oct 2, 2008
- SPEEDFAM CO., LTD.
- Kuniaki Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING COMPOSITION FOR SEMICONDUCTOR WAFER, PRODUCTION METHOD TH...
- Publication number 20080038996
- Publication date Feb 14, 2008
- NIPPON CHEMICAL INDUSTRIAL CO., LTD.
- Kuniaki MAEJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Kuniaki Maejima

Person

Patents Grantslast 30 patents

Polishing composition for semiconductor wafer and polishing method

Polishing composition for semiconductor wafer, method for productio...

Process for preparing silicic acid hydrate

Patents Applicationslast 30 patents

Polishing composition for semiconductor wafer

Colloidal silica for semiconductor wafer polishing and production m...

Colloidal silica consisting of silica particles fixing nitrogen con...

Polishing compound for semiconductor wafer polishing and polishing...

Polishing composition for semiconductor wafer and polishing method

Polishing composition for semiconductor wafer, method for productio...

Composition for polishing semiconductor wafer, and method of produc...

POLISHING COMPOSITION FOR SEMICONDUCTOR WAFER, PRODUCTION METHOD TH...