Kuniaki Oonishi

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Fukushima, JP

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Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ETCHING SILICON WAFER
- Publication number 20230178390
- Publication date Jun 8, 2023
- Shin-Etsu Handotai Co., Ltd.
- Kuniaki OONISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CHAMFERING WAFER
- Publication number 20120100785
- Publication date Apr 26, 2012
- Shin-Etsu Handotai Co., Ltd.
- Yukio Ishimasa
- B24 - GRINDING POLISHING