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Kuniaki Sueoka

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  • Kanagawa, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    LARGE CAPACITY SOLID STATE BATTERY
    • Publication number 20230170532
    • Publication date Jun 1, 2023
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UNDERFILL INJECTION FOR ELECTRONIC DEVICES
    • Publication number 20220238403
    • Publication date Jul 28, 2022
    • International Business Machines Corporation
    • AKIHIRO HORIBE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SAMPLING OF BREATH GAS
    • Publication number 20210239679
    • Publication date Aug 5, 2021
    • International Business Machines Corporation
    • Akihiro Horibe
    • G01 - MEASURING TESTING
  • Information Patent Application

    STACKED DEVICE STRUCTURE
    • Publication number 20200358087
    • Publication date Nov 12, 2020
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRON DEVICE STACK STRUCTURE
    • Publication number 20200176821
    • Publication date Jun 4, 2020
    • International Business Machines Corporation
    • Kuniaki Sueoka
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    STACKED FILM BATTERY ARCHITECTURE
    • Publication number 20190305355
    • Publication date Oct 3, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED FILM BATTERY ARCHITECTURE
    • Publication number 20190296387
    • Publication date Sep 26, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDUCTION OF STRESS IN VIA STRUCTURE
    • Publication number 20190214339
    • Publication date Jul 11, 2019
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS
    • Publication number 20190139840
    • Publication date May 9, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS
    • Publication number 20190103327
    • Publication date Apr 4, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER SCALE TESTING AND INITIALIZATION OF SMALL DIE CHIPS
    • Publication number 20190103328
    • Publication date Apr 4, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LARGE CAPACITY SOLID STATE BATTERY
    • Publication number 20190051943
    • Publication date Feb 14, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LARGE CAPACITY SOLID STATE BATTERY
    • Publication number 20190051944
    • Publication date Feb 14, 2019
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF
    • Publication number 20180366388
    • Publication date Dec 20, 2018
    • International Business Machines Corporation
    • Akihiro HORIBE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDUCTION OF STRESS IN VIA STRUCTURE
    • Publication number 20180294214
    • Publication date Oct 11, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    REDUCTION OF STRESS IN VIA STRUCTURE
    • Publication number 20180294213
    • Publication date Oct 11, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INJECTION MOLDED SOLDER BUMPING
    • Publication number 20180277509
    • Publication date Sep 27, 2018
    • International Business Machines Corporation
    • Toyohiro Aoki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PICKING UP IRREGULAR SEMICONDUCTOR CHIPS
    • Publication number 20180218952
    • Publication date Aug 2, 2018
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED FILM BATTERY ARCHITECTURE
    • Publication number 20180083304
    • Publication date Mar 22, 2018
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLDER FILL INTO HIGH ASPECT THROUGH HOLES
    • Publication number 20170338152
    • Publication date Nov 23, 2017
    • International Business Machines Corporation
    • Toyohiro Aoki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER FILL INTO HIGH ASPECT THROUGH HOLES
    • Publication number 20170263498
    • Publication date Sep 14, 2017
    • International Business Machines Corporation
    • Toyohiro Aoki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF
    • Publication number 20160141218
    • Publication date May 19, 2016
    • International Business Machines Corporation
    • Akihiro HORIBE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE INCLUDING A THROUGH ELECTRODE, AND METHOD F...
    • Publication number 20160099175
    • Publication date Apr 7, 2016
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE INCLUDING A THROUGH ELECTRODE, AND METHOD F...
    • Publication number 20160056129
    • Publication date Feb 25, 2016
    • International Business Machines Corporation
    • Akihiro Horibe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS
    • Publication number 20130119536
    • Publication date May 16, 2013
    • International Business Machines Corporation
    • Sayuri Hada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR BONDING APPARATUS
    • Publication number 20120312863
    • Publication date Dec 13, 2012
    • International Business Machines Corporation
    • Kuniaki Sueoka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING OPTICAL COUPLING ELEMENT, OPTICAL TRANSMIS...
    • Publication number 20120267338
    • Publication date Oct 25, 2012
    • International Business Machines Corporation
    • Shigeru Nakagawa
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    SEMICONDUCTOR BONDING APPARATUS
    • Publication number 20120248598
    • Publication date Oct 4, 2012
    • International Business Machines Corporation
    • Kuniaki Sueoka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMAL INTERFACE STRUCTURE AND THE MANUFACTURING METHOD THEREOF
    • Publication number 20120031553
    • Publication date Feb 9, 2012
    • International Business Machines Corporation
    • Kuniaki Sueoka
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SHEET HAVING HIGH THERMAL CONDUCTIVITY AND FLEXIBILITY
    • Publication number 20110198067
    • Publication date Aug 18, 2011
    • INTERNATIONAL BUSINESS MACHINES CORPORATION
    • Sayuri Hada
    • B32 - LAYERED PRODUCTS