Kunihiko AKAI

Person

Chiyoda-ku, Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder bump forming member, method for manufacturing solder bump fo...
- Patent number 12,246,398
- Issue date Mar 11, 2025
- Resonac Corporation
- Kunihiko Akai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and method for producing the anisotropi...
- Patent number 12,247,270
- Issue date Mar 11, 2025
- Resonac Corporation
- Kunihiko Akai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder particles
- Patent number 12,172,240
- Issue date Dec 24, 2024
- Resonac Corporation
- Kunihiko Akai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES
- Publication number 20250083262
- Publication date Mar 13, 2025
- Resonac Corporation
- Kunihiko AKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING-FORMING MEMBER, WIRING LAYER FORMING METHOD USING WIRING-FOR...
- Publication number 20250024609
- Publication date Jan 16, 2025
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR MANUF...
- Publication number 20240297135
- Publication date Sep 5, 2024
- Resonac Corporation
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...
- Publication number 20240105653
- Publication date Mar 28, 2024
- Resonac Corporation
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVIC...
- Publication number 20240079345
- Publication date Mar 7, 2024
- Masashi OHKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENTS, AND SU...
- Publication number 20230397337
- Publication date Dec 7, 2023
- Hiroyuki IZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20230328897
- Publication date Oct 12, 2023
- Showa Denko Materials Co., Ltd.
- Hiroyuki IZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FO...
- Publication number 20230042727
- Publication date Feb 9, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES
- Publication number 20210229222
- Publication date Jul 29, 2021
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING SAME, AND METHOD...
- Publication number 20210114147
- Publication date Apr 22, 2021
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES
- Publication number 20210114145
- Publication date Apr 22, 2021
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Kunihiko AKAI

Person

Patents Grantslast 30 patents

Solder bump forming member, method for manufacturing solder bump fo...

Anisotropic conductive film and method for producing the anisotropi...

Solder particles

Connection structure and manufacturing method therefor

Patents Applicationslast 30 patents

SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES

WIRING-FORMING MEMBER, WIRING LAYER FORMING METHOD USING WIRING-FOR...

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR MANUF...

SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...

ELECTROCONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVIC...

METHOD FOR MANUFACTURING SUBSTRATE WITH BUILT-IN COMPONENTS, AND SU...

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FO...

SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING SAME, AND METHOD...

SOLDER PARTICLES