Kunihiko UENO

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Shinjuku-ku, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate assembly, method of manufacturing substrate assembly and...
- Patent number 9,245,814
- Issue date Jan 26, 2016
- Hoya Corporation
- Takashi Fushie
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE ASSEMBLY, METHOD OF MANUFACTURING SUBSTRATE ASSEMBLY AND...
- Publication number 20140301050
- Publication date Oct 9, 2014
- HOYA CORPORATION
- Takashi FUSHIE
- H01 - BASIC ELECTRIC ELEMENTS