Kuniko ISHIKAWA

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing optical waveguide device and optical wavegu...
- Patent number 8,861,903
- Issue date Oct 14, 2014
- Fujitsu Limited
- Takatoyo Yamakami
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electroconductive bonding material, method for bonding conductor, a...
- Patent number 8,418,910
- Issue date Apr 16, 2013
- Fujitsu Limited
- Takatoyo Yamakami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming electrode connecting portion
- Patent number 8,076,233
- Issue date Dec 13, 2011
- Fujitsu Limited
- Kuniko Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic component and an electronic d...
- Patent number 7,833,831
- Issue date Nov 16, 2010
- Fujitsu Limited
- Norio Kainuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting an electronic component and mounting apparatus
- Patent number 7,828,193
- Issue date Nov 9, 2010
- Fujitsu Limited
- Kuniko Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,566,586
- Issue date Jul 28, 2009
- Fujitsu Limited
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RFID TAG
- Publication number 20140103117
- Publication date Apr 17, 2014
- FUJITSU LIMITED
- Shuichi TAKEUCHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20130313309
- Publication date Nov 28, 2013
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING OPTICAL WAVEGUIDE DEVICE AND OPTICAL WAVEGU...
- Publication number 20130259421
- Publication date Oct 3, 2013
- Fujitsu Limited
- Takatoyo YAMAKAMI
- G02 - OPTICS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF
- Publication number 20130249087
- Publication date Sep 26, 2013
- Fujitsu Limited
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC D...
- Publication number 20130140069
- Publication date Jun 6, 2013
- Fujitsu Limited
- Masayuki KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...
- Publication number 20130088839
- Publication date Apr 11, 2013
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICOND...
- Publication number 20130087605
- Publication date Apr 11, 2013
- Fujitsu Limited
- Takashi KUBOTA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND SOLDERING PASTE
- Publication number 20120248616
- Publication date Oct 4, 2012
- Fujitsu Limited
- Masayuki KITAJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
- Publication number 20120211549
- Publication date Aug 23, 2012
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD
- Publication number 20110079896
- Publication date Apr 7, 2011
- Fujitsu Limited
- Yoshiyuki Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF
- Publication number 20100327435
- Publication date Dec 30, 2010
- FUJITSU LIMITED
- Kimio Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING ELECTRODE CONNECTING PORTION
- Publication number 20100075493
- Publication date Mar 25, 2010
- Fujitsu Limited
- Kuniko Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of mounting an electronic component and mounting apparatus
- Publication number 20080203138
- Publication date Aug 28, 2008
- Fujitsu Limited
- Kuniko Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT AND AN ELECTRONIC D...
- Publication number 20080206587
- Publication date Aug 28, 2008
- FUJITSU LIMITED
- Norio Kainuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20070264752
- Publication date Nov 15, 2007
- FUJITSU LIMITED
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS

Kuniko ISHIKAWA

Person

Patents Grantslast 30 patents

Method of manufacturing optical waveguide device and optical wavegu...

Electroconductive bonding material, method for bonding conductor, a...

Method of forming electrode connecting portion

Method of manufacturing an electronic component and an electronic d...

Method of mounting an electronic component and mounting apparatus

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

RFID TAG

CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND...

METHOD OF MANUFACTURING OPTICAL WAVEGUIDE DEVICE AND OPTICAL WAVEGU...

ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF

CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC D...

BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...

CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICOND...

ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND SOLDERING PASTE

ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

ELECTRONIC COMPONENT AND MANUFACTURE METHOD THEREOF

METHOD OF FORMING ELECTRODE CONNECTING PORTION

Method of mounting an electronic component and mounting apparatus

METHOD OF MANUFACTURING AN ELECTRONIC COMPONENT AND AN ELECTRONIC D...

Method of manufacturing a semiconductor device