TREA

Kunimitsu Takahashi

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Protective film thickness measuring method
    • Patent number 11,892,282
    • Issue date Feb 6, 2024
    • Disco Corporation
    • Hiroto Yoshida
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Facet region detecting method and detecting apparatus
    • Patent number 10,852,240
    • Issue date Dec 1, 2020
    • Disco Corporation
    • Naoki Murazawa
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Wafer producing method
    • Patent number 10,625,371
    • Issue date Apr 21, 2020
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 10,369,659
    • Issue date Aug 6, 2019
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 10,076,804
    • Issue date Sep 18, 2018
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,925,619
    • Issue date Mar 27, 2018
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,884,390
    • Issue date Feb 6, 2018
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,789,565
    • Issue date Oct 17, 2017
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,764,428
    • Issue date Sep 19, 2017
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,764,420
    • Issue date Sep 19, 2017
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,517,530
    • Issue date Dec 13, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer producing method
    • Patent number 9,481,051
    • Issue date Nov 1, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,054,179
    • Issue date Jun 9, 2015
    • Disco Corporation
    • Chikara Aikawa
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    INSPECTION APPARATUS
    • Publication number 20230280249
    • Publication date Sep 7, 2023
    • Disco Corporation
    • Naoki MURAZAWA
    • G01 - MEASURING TESTING
  • Information Patent Application

    PROCESSING METHOD AND PROCESSING APPARATUS FOR INGOT
    • Publication number 20220395931
    • Publication date Dec 15, 2022
    • Disco Corporation
    • Asahi NOMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROTECTIVE FILM THICKNESS MEASURING METHOD
    • Publication number 20220373321
    • Publication date Nov 24, 2022
    • Disco Corporation
    • Hiroto YOSHIDA
    • G01 - MEASURING TESTING
  • Information Patent Application

    FACET REGION DETECTING METHOD AND DETECTING APPARATUS
    • Publication number 20200064269
    • Publication date Feb 27, 2020
    • Disco Corporation
    • Naoki MURAZAWA
    • G01 - MEASURING TESTING
  • Information Patent Application

    SEMICONDUCTOR INGOT INSPECTING METHOD AND APPARATUS, AND LASER PROC...
    • Publication number 20180254223
    • Publication date Sep 6, 2018
    • Disco Corporation
    • Kazuya Hirata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160288250
    • Publication date Oct 6, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160228983
    • Publication date Aug 11, 2016
    • Disco Corporation
    • Kazuya Hirata
    • C30 - CRYSTAL GROWTH
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160228984
    • Publication date Aug 11, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160228985
    • Publication date Aug 11, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160193691
    • Publication date Jul 7, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160193690
    • Publication date Jul 7, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160158892
    • Publication date Jun 9, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160158881
    • Publication date Jun 9, 2016
    • Disco Corporation
    • Kazuya Hirata
    • C30 - CRYSTAL GROWTH
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160158883
    • Publication date Jun 9, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD
    • Publication number 20160158882
    • Publication date Jun 9, 2016
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20150104930
    • Publication date Apr 16, 2015
    • Disco Corporation
    • Chikara Aikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LASER BEAM MACHINING APPARATUS
    • Publication number 20090127233
    • Publication date May 21, 2009
    • Disco Corporation
    • Kenji Asano
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR