Kunio Arai

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for printed circuit board and laser processing...
- Patent number 11,576,265
- Issue date Feb 7, 2023
- OFUNA ENTERPRISE JAPAN CO., LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and electrolytic etch...
- Patent number 8,366,903
- Issue date Feb 5, 2013
- Hitachi Via Mechanics
- Toshinori Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining method and laser machining apparatus
- Patent number 8,319,147
- Issue date Nov 27, 2012
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for perforating printed circuit board
- Patent number 8,278,594
- Issue date Oct 2, 2012
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of printed circuit board and printed circuit boa...
- Patent number 8,075,788
- Issue date Dec 13, 2011
- Hitachiviamechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining method and laser machining apparatus
- Patent number 7,923,659
- Issue date Apr 12, 2011
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed wiring board as well as copper-clad...
- Patent number 7,666,320
- Issue date Feb 23, 2010
- Hitachi Via Mechanics, Ltd.
- Toshinori Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for laser perforating printed circuit board
- Patent number 7,531,767
- Issue date May 12, 2009
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining method and laser machining apparatus
- Patent number 7,205,501
- Issue date Apr 17, 2007
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multibeam laser drilling apparatus
- Patent number 6,849,824
- Issue date Feb 1, 2005
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for drilling printed wiring boards
- Patent number 6,531,677
- Issue date Mar 11, 2003
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser beam machining and laser beam machine
- Patent number 6,521,866
- Issue date Feb 18, 2003
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus of making a hole in a printed circuit board
- Patent number 6,479,788
- Issue date Nov 12, 2002
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for laser processing with a mechanical cutter
- Patent number 6,043,453
- Issue date Mar 28, 2000
- Hitachi Via Mechanics Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Drill bit and step feeding method
- Patent number 5,888,036
- Issue date Mar 30, 1999
- Hitachi Seiko, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of and apparatus for laser processing
- Patent number 5,756,378
- Issue date May 26, 1998
- Hitachi Seiko Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure foot of printed circuit board drilling apparatus
- Patent number 5,332,341
- Issue date Jul 26, 1994
- Hitachi Seiko Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having blind holes
- Patent number 5,315,072
- Issue date May 24, 1994
- Hitachi Seiko, Ltd.
- Kunio Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board presser device in drilling machine
- Patent number 5,199,830
- Issue date Apr 6, 1993
- Hitachi Seiko Ltd.
- Tamio Otani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low mass spindle and Z-axis unit
- Patent number 5,108,236
- Issue date Apr 28, 1992
- Hitachi, Seiko, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board boring machine
- Patent number 5,087,156
- Issue date Feb 11, 1992
- Hitachi Seiko Ltd.
- Yasuhiko Kanaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low mass spindle and Z-axis unit
- Patent number 5,078,558
- Issue date Jan 7, 1992
- Hitachi Seiko, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for drilling a printed circuit board
- Patent number 5,066,171
- Issue date Nov 19, 1991
- Hitachi Seiko Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure foot for printed circuit board drilling machine
- Patent number 5,024,562
- Issue date Jun 18, 1991
- Hitachi Seiko Ltd.
- Kunio Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of and apparatus for perforating printed circuit board
- Patent number 5,010,232
- Issue date Apr 23, 1991
- Hitachi Seiko, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for drilling a hole in a printed circuit board
- Patent number 4,997,319
- Issue date Mar 5, 1991
- Hitachi Seiko Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure foot of printed circuit board drilling apparatus
- Patent number 4,915,550
- Issue date Apr 10, 1990
- Hitachi Seiko Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of drilling printed circuit board
- Patent number 4,872,787
- Issue date Oct 10, 1989
- Hitachi Seiko Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LASER PROCESSING METHOD AND LASER PROCESSING MACHINE
- Publication number 20220288720
- Publication date Sep 15, 2022
- OFUNA ENTERPRISE Japan Co., Ltd.
- Kunio ARAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD OF PRINTED CIRCUIT BOARD AND LASER PROCESSI...
- Publication number 20220216665
- Publication date Jul 7, 2022
- OFUNA ENTERPRISE Japan Co., Ltd.
- Kunio ARAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD AND LASER PROCESSING...
- Publication number 20200214138
- Publication date Jul 2, 2020
- OFUNA ENTERPRISE Japan Co., Ltd.
- Kunio ARAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Machining Thin-Film Layer of Workpiece
- Publication number 20120031147
- Publication date Feb 9, 2012
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATMENT METHOD FOR COPPER AND SURFACE TREATMENT METHOD FO...
- Publication number 20110036493
- Publication date Feb 17, 2011
- Toshinori Kawamura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for perforating printed circuit board
- Publication number 20090166340
- Publication date Jul 2, 2009
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed wiring board and electrolytic etch...
- Publication number 20090084684
- Publication date Apr 2, 2009
- Toshinori Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication method of printed circuit board and printed circuit boa...
- Publication number 20080283491
- Publication date Nov 20, 2008
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Method for Processing Printed Circuit Board
- Publication number 20080230512
- Publication date Sep 25, 2008
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser Machining Method and Laser Machining Apparatus
- Publication number 20080053974
- Publication date Mar 6, 2008
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite sheet, machining method for composite sheet and laser mac...
- Publication number 20080008854
- Publication date Jan 10, 2008
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser machining method and laser machining apparatus
- Publication number 20070075059
- Publication date Apr 5, 2007
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of printed wiring board as well as copper-clad...
- Publication number 20060270232
- Publication date Nov 30, 2006
- Toshinori Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for perforating printed circuit board
- Publication number 20060211158
- Publication date Sep 21, 2006
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for laser drilling
- Publication number 20060076323
- Publication date Apr 13, 2006
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and method for processing printed circuit board
- Publication number 20050244621
- Publication date Nov 3, 2005
- Hitachi Via Mechanics Ltd.
- Kunio Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser machining method and laser machining apparatus
- Publication number 20050155958
- Publication date Jul 21, 2005
- Hitachi Via Mechanics Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for laser drilling
- Publication number 20040217093
- Publication date Nov 4, 2004
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser drilling method
- Publication number 20040140299
- Publication date Jul 22, 2004
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multibeam laser drilling apparatus
- Publication number 20040129685
- Publication date Jul 8, 2004
- HITACHI VIA MECHANICS, LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for drilling printed wiring boards
- Publication number 20020040893
- Publication date Apr 11, 2002
- Hitachi Via Mechanics, Ltd.
- Kunio Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Manufacturing method for printed circuit board and laser processing...

Method for manufacturing printed wiring board and electrolytic etch...

Laser machining method and laser machining apparatus

Method and apparatus for perforating printed circuit board

Fabrication method of printed circuit board and printed circuit boa...

Laser machining method and laser machining apparatus

Manufacturing method of printed wiring board as well as copper-clad...

Method and apparatus for laser perforating printed circuit board

Laser machining method and laser machining apparatus

Multibeam laser drilling apparatus

Method and apparatus for drilling printed wiring boards

Laser beam machining and laser beam machine

Method and apparatus of making a hole in a printed circuit board

Apparatus for laser processing with a mechanical cutter

Drill bit and step feeding method

Method of and apparatus for laser processing

Pressure foot of printed circuit board drilling apparatus

Printed wiring board having blind holes

Printed circuit board presser device in drilling machine

Low mass spindle and Z-axis unit

Printed circuit board boring machine

Low mass spindle and Z-axis unit

Method for drilling a printed circuit board

Pressure foot for printed circuit board drilling machine

Method of and apparatus for perforating printed circuit board

Apparatus for drilling a hole in a printed circuit board

Pressure foot of printed circuit board drilling apparatus

Method of drilling printed circuit board

Patents Applicationslast 30 patents

LASER PROCESSING METHOD AND LASER PROCESSING MACHINE

LASER PROCESSING METHOD OF PRINTED CIRCUIT BOARD AND LASER PROCESSI...

MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD AND LASER PROCESSING...

Method and Apparatus for Machining Thin-Film Layer of Workpiece

SURFACE TREATMENT METHOD FOR COPPER AND SURFACE TREATMENT METHOD FO...

Method and apparatus for perforating printed circuit board

Method for manufacturing printed wiring board and electrolytic etch...

Fabrication method of printed circuit board and printed circuit boa...

Printed Circuit Board and Method for Processing Printed Circuit Board

Laser Machining Method and Laser Machining Apparatus

Composite sheet, machining method for composite sheet and laser mac...

Laser machining method and laser machining apparatus

Manufacturing method of printed wiring board as well as copper-clad...

Method and apparatus for perforating printed circuit board

Method and apparatus for laser drilling

Printed circuit board and method for processing printed circuit board

Laser machining method and laser machining apparatus

Method and apparatus for laser drilling

Laser drilling method

Multibeam laser drilling apparatus

Method and apparatus for drilling printed wiring boards