Kunio Kodama

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Kawasaki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing solder bumps and solder joints using formic...
- Patent number 6,344,407
- Issue date Feb 5, 2002
- Fujitsu Limited
- Hirohisa Matsuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with flip chip bonding pads and manufacture th...
- Patent number 6,218,281
- Issue date Apr 17, 2001
- Fujitsu Limited
- Eiji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test board for testing a semiconductor device and method of testing...
- Patent number 5,854,558
- Issue date Dec 29, 1998
- Fujitsu Limited
- Toshiyuki Motooka
- G01 - MEASURING TESTING
Information Patent Grant
Test board for testing a semiconductor device, method of testing th...
- Patent number 5,831,441
- Issue date Nov 3, 1998
- Fujitsu Limited
- Toshiyuki Motooka
- G01 - MEASURING TESTING