Kunio Ohkubo

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Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
Colloidal silica for semiconductor wafer polishing and production m...
- Publication number 20090267021
- Publication date Oct 29, 2009
- Masaru Nakajo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Colloidal silica consisting of silica particles fixing nitrogen con...
- Publication number 20090253813
- Publication date Oct 8, 2009
- Yuko Ishiguri
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL