Kunliang BU

Person

Shenzhen, CN

People

Patents Applicationslast 30 patents

Information Patent Application
AIR BRIDGE PREPARATION METHOD, QUANTUM CHIP, AND QUANTUM COMPUTER
- Publication number 20240423103
- Publication date Dec 19, 2024
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Kunliang BU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM FOR PREPARING JOSEPHSON JUNCTION
- Publication number 20230422634
- Publication date Dec 28, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dengfeng LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
QUANTUM CHIP AND METHOD FOR PREPARING THE SAME
- Publication number 20230419148
- Publication date Dec 28, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dengfeng LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PREPARING JOSEPHSON JUNCTION AND PRODUCTION LINE DEVICE
- Publication number 20230320234
- Publication date Oct 5, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Kunliang BU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH SILICON VIA INTERCONNECTION STRUCTURE AND METHOD OF FORMING...
- Publication number 20230307297
- Publication date Sep 28, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dengfeng LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON-VIA STRUCTURE AND METHOD FOR PREPARING SAME, THROUG...
- Publication number 20230197572
- Publication date Jun 22, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Weiwen ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATING METHOD FOR MAKING CHIP, CHIP SUBSTRATE, AND CHIP
- Publication number 20230099146
- Publication date Mar 30, 2023
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Dengfeng LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kunliang BU

Person

Patents Applicationslast 30 patents

AIR BRIDGE PREPARATION METHOD, QUANTUM CHIP, AND QUANTUM COMPUTER

METHOD AND SYSTEM FOR PREPARING JOSEPHSON JUNCTION

QUANTUM CHIP AND METHOD FOR PREPARING THE SAME

METHOD FOR PREPARING JOSEPHSON JUNCTION AND PRODUCTION LINE DEVICE

THROUGH SILICON VIA INTERCONNECTION STRUCTURE AND METHOD OF FORMING...

THROUGH-SILICON-VIA STRUCTURE AND METHOD FOR PREPARING SAME, THROUG...

COATING METHOD FOR MAKING CHIP, CHIP SUBSTRATE, AND CHIP