Kunmo CHU

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Paste material, wiring member formed from the paste material, and e...
- Patent number 10,392,518
- Issue date Aug 27, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,249,604
- Issue date Apr 2, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,211,194
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive material, electronic device including anisot...
- Patent number 9,831,211
- Issue date Nov 28, 2017
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL PARTICLES FOR ADHESIVE PASTE, SOLDER PASTE COMPOSITION INCLUD...
- Publication number 20250066644
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Junghoon LEE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METAL PARTICLES FOR ADHESIVE PASTE, SOLDER PASTE COMPOSITION INCLUD...
- Publication number 20220235248
- Publication date Jul 28, 2022
- Samsung Electronics Co., Ltd.
- Junghoon LEE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...
- Publication number 20220093549
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
- Publication number 20220077100
- Publication date Mar 10, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASTE MATERIAL, WIRING MEMBER FORMED FROM THE PASTE MATERIAL, AND E...
- Publication number 20180148584
- Publication date May 31, 2018
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANISOTROPIC CONDUCTIVE MATERIAL, ELECTRONIC DEVICE INCLUDING ANISOT...
- Publication number 20170062374
- Publication date Mar 2, 2017
- Industry-Academic Cooperation Foundation, Yonsei University
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160049564
- Publication date Feb 18, 2016
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Hybrid bonding structures and semiconductor devices including the same

Paste material, wiring member formed from the paste material, and e...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Anisotropic conductive material, electronic device including anisot...

Patents Applicationslast 30 patents

METAL PARTICLES FOR ADHESIVE PASTE, SOLDER PASTE COMPOSITION INCLUD...

METAL PARTICLES FOR ADHESIVE PASTE, SOLDER PASTE COMPOSITION INCLUD...

HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...

HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME

PASTE MATERIAL, WIRING MEMBER FORMED FROM THE PASTE MATERIAL, AND E...

ANISOTROPIC CONDUCTIVE MATERIAL, ELECTRONIC DEVICE INCLUDING ANISOT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME