Kunsang Park

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including penetratio...
- Patent number 11,728,245
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through substrate vias and method of...
- Patent number 11,600,553
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Myungjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,342,221
- Issue date May 24, 2022
- Samsung Electronics Co., Ltd.
- Jaewon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through substrate vias and method of...
- Patent number 11,101,196
- Issue date Aug 24, 2021
- Samsung Electronics Co., Ltd.
- Myungjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating semiconductor devices having through electr...
- Patent number 9,543,200
- Issue date Jan 10, 2017
- Samsung Electronics Co., Ltd.
- Kunsang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through silicon via electrodes and...
- Patent number 9,153,559
- Issue date Oct 6, 2015
- Samsung Electronics Co., Ltd.
- Dosun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through electrodes
- Patent number 8,872,351
- Issue date Oct 28, 2014
- Samsung Electronics Co., Ltd.
- Kwangjin Moon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING SEMICONDUCTOR DEVICE, AND CHIP FOR BONDING SEMICONDUCTOR DE...
- Publication number 20240312935
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Joo Hee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240038708
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- KUNSANG PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20230335467
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005853
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Kunsang PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20220037236
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH SUBSTRATE VIAS AND METHOD OF...
- Publication number 20210351112
- Publication date Nov 11, 2021
- Samsung Electronics Co., Ltd.
- Myungjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210066123
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Jaewon Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH SUBSTRATE VIAS AND METHOD OF...
- Publication number 20210020544
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- Myungjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Fabricating Semiconductor Devices Having Through Electr...
- Publication number 20140235052
- Publication date Aug 21, 2014
- Samsung Electronics Co., Ltd.
- Kunsang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS FOR FAB...
- Publication number 20130200526
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- Kwangjin Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING THROUGH SILICON VIA ELECTRODES AND...
- Publication number 20130127019
- Publication date May 23, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Dosun LEE
- H01 - BASIC ELECTRIC ELEMENTS

Kunsang Park

Person

Patents Grantslast 30 patents

Semiconductor device including penetration via structure

Semiconductor device and semiconductor package including penetratio...

Semiconductor device including through substrate vias and method of...

Semiconductor device

Semiconductor device including through substrate vias and method of...

Methods for fabricating semiconductor devices having through electr...

Semiconductor devices including through silicon via electrodes and...

Semiconductor devices having through electrodes

Patents Applicationslast 30 patents

BONDING SEMICONDUCTOR DEVICE, AND CHIP FOR BONDING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE INCLUDING THROUGH SUBSTRATE VIAS AND METHOD OF...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING THROUGH SUBSTRATE VIAS AND METHOD OF...

Methods for Fabricating Semiconductor Devices Having Through Electr...

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS FOR FAB...

SEMICONDUCTOR DEVICES INCLUDING THROUGH SILICON VIA ELECTRODES AND...