Kunsil Lee

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including plurality of semiconductor chips an...
- Patent number 11,935,868
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support substrates, methods of fabricating semiconductor packages u...
- Patent number 11,908,727
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support substrates, methods of fabricating semiconductor packages u...
- Patent number 11,631,608
- Issue date Apr 18, 2023
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support substrates, methods of fabricating semiconductor packages u...
- Patent number 10,825,710
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,665,571
- Issue date May 26, 2020
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,256,215
- Issue date Apr 9, 2019
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,941,252
- Issue date Apr 10, 2018
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240222303
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Daehyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AN...
- Publication number 20240186294
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Kunsil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASE FILM FOR MOLD PROCESS, AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240014049
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Chulho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230005872
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Dongkwan Kim
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AN...
- Publication number 20220223566
- Publication date Jul 14, 2022
- Samsung Electronics Co., Ltd.
- Kunsil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT SUBSTRATES, METHODS OF FABRICATING SEMICONDUCTOR PACKAGES U...
- Publication number 20220165603
- Publication date May 26, 2022
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT SUBSTRATES, METHODS OF FABRICATING SEMICONDUCTOR PACKAGES U...
- Publication number 20210020490
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190206844
- Publication date Jul 4, 2019
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support Substrates, Methods of Fabricating Semiconductor Packages U...
- Publication number 20190088524
- Publication date Mar 21, 2019
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180211937
- Publication date Jul 26, 2018
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170358558
- Publication date Dec 14, 2017
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package including plurality of semiconductor chips an...

Support substrates, methods of fabricating semiconductor packages u...

Support substrates, methods of fabricating semiconductor packages u...

Support substrates, methods of fabricating semiconductor packages u...

Semiconductor package

Semiconductor package

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AN...

RELEASE FILM FOR MOLD PROCESS, AND METHOD FOR MANUFACTURING THE SAME

ADHESIVE SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS AN...

SUPPORT SUBSTRATES, METHODS OF FABRICATING SEMICONDUCTOR PACKAGES U...

SUPPORT SUBSTRATES, METHODS OF FABRICATING SEMICONDUCTOR PACKAGES U...

SEMICONDUCTOR PACKAGE

Support Substrates, Methods of Fabricating Semiconductor Packages U...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE