Kuo-Chan Hsu

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and process of integrated circuit having latch-up suppres...
- Patent number 11,961,769
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Hsiu Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Static random access memory layout
- Patent number 11,942,145
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, structures and devices for intra-connection structures
- Patent number 11,943,908
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin-based well straps for improving memory macro performance
- Patent number 11,937,415
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chuan Yang
Information Patent Grant
Automated schematic check
- Patent number 11,907,632
- Issue date Feb 20, 2024
- Quanta Computer Inc.
- Kuo-Chan Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor die package with conductive line crack prevention design
- Patent number 11,854,956
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Huei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,848,270
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a reconstructed package substrate comprising sub...
- Patent number 11,842,935
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adjusting multicast broadcast service area and network a...
- Patent number 11,838,832
- Issue date Dec 5, 2023
- Industrial Technology Research Institute
- Yu-Dai Yan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
3D packages and methods for forming the same
- Patent number 11,830,745
- Issue date Nov 28, 2023
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fish bone structure and methods of formin...
- Patent number 11,791,422
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-pullout and low-resistance screw
- Patent number 11,788,569
- Issue date Oct 17, 2023
- Kuo-Tai Hsu
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Key structure
- Patent number 11,764,007
- Issue date Sep 19, 2023
- Lite-On Technology Corporation
- Kuo-Hui Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure and test method thereof
- Patent number 11,728,227
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with conductive adhesive layer
- Patent number 11,728,180
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Button assembly
- Patent number 11,721,499
- Issue date Aug 8, 2023
- Lite-On Electronics (Guangzhou) Limited
- Kuo-Hui Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin-based well straps for improving memory macro performance
- Patent number 11,690,209
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chuan Yang
Information Patent Grant
SRAM cell with balanced write port
- Patent number 11,678,474
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Hsiu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biodegradable hair ornament
- Patent number 11,653,736
- Issue date May 23, 2023
- Kuo-Yang Hsu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
SRAM design with four-poly-pitch
- Patent number 11,657,869
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chuan Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Source/drain feature separation structure
- Patent number 11,637,109
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chun Keng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clipped testing device having a flexible conducting member
- Patent number 11,630,126
- Issue date Apr 18, 2023
- CHROMA ATE INC.
- Hsu-Chang Hsu
- G01 - MEASURING TESTING
Information Patent Grant
Keyboard
- Patent number 11,581,153
- Issue date Feb 14, 2023
- Lite-On Electronics (Guangzhou) Limited
- Kuo-Hui Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Current sensing circuit for generating sensed current signal with a...
- Patent number 11,581,795
- Issue date Feb 14, 2023
- Mediatek Inc.
- Wei-Chung Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Device and method of building test file
- Patent number 11,573,886
- Issue date Feb 7, 2023
- Inventec (Pudong) Technology Corp.
- Che-Sheng Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Switching regulator using protection circuit for avoiding voltage s...
- Patent number 11,557,971
- Issue date Jan 17, 2023
- Mediatek Inc.
- Wei-Chung Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Shared bit lines for memory cells
- Patent number 11,552,084
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Clamping circuit
- Patent number 11,539,286
- Issue date Dec 27, 2022
- Quanta Computer Inc.
- Kuo-Chan Hsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,532,583
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four-poly-pitch SRAM cell with backside metal tracks
- Patent number 11,527,539
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Hsiu Hsu
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
WATERPROOF ELECTRICAL CONNECTOR WITH IMPROVED SEALING CUSHION
- Publication number 20240136760
- Publication date Apr 25, 2024
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- JIAN-KUANG ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC LIGHT EMITTING ELEMENT
- Publication number 20240138171
- Publication date Apr 25, 2024
- TAIZHOU GUANYU TECHNOLOGY CO., LTD.
- HUEI-SIOU CHEN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP STRUCTURE
- Publication number 20240120277
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN
- Publication number 20240096778
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Huei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING ASSEMBLY
- Publication number 20240065025
- Publication date Feb 22, 2024
- TAIZHOU GUANYU TECHNOLOGY CO., LTD.
- CHIH-CHENG YEN
Information Patent Application
LIGHT-EMITTING ELEMENT
- Publication number 20240032330
- Publication date Jan 25, 2024
- TAIZHOU GUANYU TECHNOLOGY CO., LTD.
- HUEI-SIOU CHEN
Information Patent Application
LIGHT-EMITTING ELEMENT
- Publication number 20240023386
- Publication date Jan 18, 2024
- TAIZHOU GUANYU TECHNOLOGY CO., LTD.
- HUEI-SIOU CHEN
Information Patent Application
LASER-LESS PACKAGING SUBSTRATE MANUFACTURE METHOD AND STRUCTURES FO...
- Publication number 20240021437
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ching HSU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor Device With Fish Bone Structure And Methods Of Formin...
- Publication number 20230387326
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230371327
- Publication date Nov 16, 2023
- TAIZHOU GUANYU TECHNOLOGY CO., LTD.
- KUO-CHENG HSU
Information Patent Application
MACRO AND SRAM BIT CELL COOPTIMIZATOIN FOR PERFORMANCE (LONG/SHORTW...
- Publication number 20230371225
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Application
TEST STRUCTURE AND TEST METHOD THEREOF
- Publication number 20230369143
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20230335411
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SRAM CELL WITH BALANCED WRITE PORT
- Publication number 20230328948
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Hsiu Hsu
- G11 - INFORMATION STORAGE
Information Patent Application
CARD EDGE CONNECTOR WITH AN IMPROVED METAL SHELL
- Publication number 20230299541
- Publication date Sep 21, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- PO-FU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR ASSEMBLY WITH IMPROVED TERMINALS
- Publication number 20230283018
- Publication date Sep 7, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- KUO-CHUN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SRAM Design with Four-Poly-Pitch
- Publication number 20230267991
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chuan Yang
- G11 - INFORMATION STORAGE
Information Patent Application
LOW EARTH ORBIT SATELLITE SYSTEM AND HANDOVER METHOD FOR LOW EARTH...
- Publication number 20230171663
- Publication date Jun 1, 2023
- Industrial Technology Research Institute
- Tien Yuan HSIEH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEAT DISSIPATION ASSEMBLY
- Publication number 20230171917
- Publication date Jun 1, 2023
- Delta Electronics, Inc.
- Yi-Han Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHARED BIT LINES FOR MEMORY CELLS
- Publication number 20230164971
- Publication date May 25, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Four-Poly-Pitch Sram Cell With Backside Metal Tracks
- Publication number 20230105495
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Hsiu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, PACKAGE USING THE SAME, AND METHOD OF MANUFACTUR...
- Publication number 20230062775
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hungen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Process of Integrated Circuit Having Latch-Up Suppres...
- Publication number 20230059973
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Hsiu Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN
- Publication number 20230016849
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Huei LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STATIC RANDOM ACCESS MEMORY LAYOUT
- Publication number 20230012621
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chuan YANG
- G11 - INFORMATION STORAGE
Information Patent Application
GRAPHITE COMPOSITE LAMINATED HEAT-DISSIPATING STRUCTURE AND MANUFAC...
- Publication number 20220397352
- Publication date Dec 15, 2022
- LONG YOUNG (SAMOA) HOLDING CO., LIMITED, TAIWAN BRANCH (SAMOA)
- KUO-CHEN HSU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Device and Method of Building Test File
- Publication number 20220391307
- Publication date Dec 8, 2022
- Inventec (Pudong) Technology Corp.
- Che-Sheng Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Packages with Multiple Encapsulated Substrate Blocks
- Publication number 20220384287
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufactuting Co., LLtd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source/Drain Feature Separation Structure
- Publication number 20220367482
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chun Keng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin-Based Well Straps For Improving Memory Macro Performance
- Publication number 20220367481
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chuan Yang
- H01 - BASIC ELECTRIC ELEMENTS

Kuo-Chan Hsu

Person

Patents Grantslast 30 patents

Structure and process of integrated circuit having latch-up suppres...

Static random access memory layout

Method, structures and devices for intra-connection structures

Fin-based well straps for improving memory macro performance

Automated schematic check

Semiconductor die package with conductive line crack prevention design

Chip structure and method for forming the same

Method for forming a reconstructed package substrate comprising sub...

Method for adjusting multicast broadcast service area and network a...

3D packages and methods for forming the same

Semiconductor device with fish bone structure and methods of formin...

Anti-pullout and low-resistance screw

Key structure

Test structure and test method thereof

Chip package structure with conductive adhesive layer

Button assembly

Fin-based well straps for improving memory macro performance

SRAM cell with balanced write port

Biodegradable hair ornament

SRAM design with four-poly-pitch

Source/drain feature separation structure

Clipped testing device having a flexible conducting member

Keyboard

Current sensing circuit for generating sensed current signal with a...

Device and method of building test file

Switching regulator using protection circuit for avoiding voltage s...

Shared bit lines for memory cells

Clamping circuit

Semiconductor structure and manufacturing method thereof

Four-poly-pitch SRAM cell with backside metal tracks

Patents Applicationslast 30 patents

WATERPROOF ELECTRICAL CONNECTOR WITH IMPROVED SEALING CUSHION

ORGANIC LIGHT EMITTING ELEMENT

CHIP STRUCTURE

SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN

LIGHT-EMITTING ASSEMBLY

LIGHT-EMITTING ELEMENT

LIGHT-EMITTING ELEMENT

LASER-LESS PACKAGING SUBSTRATE MANUFACTURE METHOD AND STRUCTURES FO...

Semiconductor Device With Fish Bone Structure And Methods Of Formin...

LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING THE SAME

MACRO AND SRAM BIT CELL COOPTIMIZATOIN FOR PERFORMANCE (LONG/SHORTW...

TEST STRUCTURE AND TEST METHOD THEREOF

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

SRAM CELL WITH BALANCED WRITE PORT

CARD EDGE CONNECTOR WITH AN IMPROVED METAL SHELL

ELECTRICAL CONNECTOR ASSEMBLY WITH IMPROVED TERMINALS

SRAM Design with Four-Poly-Pitch

LOW EARTH ORBIT SATELLITE SYSTEM AND HANDOVER METHOD FOR LOW EARTH...

HEAT DISSIPATION ASSEMBLY

SHARED BIT LINES FOR MEMORY CELLS

Four-Poly-Pitch Sram Cell With Backside Metal Tracks

PACKAGE SUBSTRATE, PACKAGE USING THE SAME, AND METHOD OF MANUFACTUR...

Structure and Process of Integrated Circuit Having Latch-Up Suppres...

SEMICONDUCTOR DIE PACKAGE WITH CONDUCTIVE LINE CRACK PREVENTION DESIGN

STATIC RANDOM ACCESS MEMORY LAYOUT

GRAPHITE COMPOSITE LAMINATED HEAT-DISSIPATING STRUCTURE AND MANUFAC...

Device and Method of Building Test File

Packages with Multiple Encapsulated Substrate Blocks

Source/Drain Feature Separation Structure

Fin-Based Well Straps For Improving Memory Macro Performance