Kuo-Cheng Lien

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
CMP slurry solution for hardened fluid material
- Patent number 11,312,882
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Yin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP-friendly coatings for planar recessing or removing of variable-...
- Patent number 11,011,385
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Kuei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry solution for hardened fluid material
- Patent number 10,774,241
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Yin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adjusting etching parameters
- Patent number 10,707,139
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Sheng Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer back-side polishing system and method for integrated circuit...
- Patent number 9,852,899
- Issue date Dec 26, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Nan Lee
- B24 - GRINDING POLISHING
Information Patent Grant
CMP-friendly coatings for planar recessing or removing of variable-...
- Patent number 9,748,109
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Kuei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP slurry solution for hardened fluid material
- Patent number 9,567,493
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Yin Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer back-side polishing system and method for integrated circuit...
- Patent number 9,559,021
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Nan Lee
- B24 - GRINDING POLISHING
Information Patent Grant
BARC-assisted process for planar recessing or removing of variable-...
- Patent number 9,478,431
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Kuei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retainer ring
- Patent number 9,434,047
- Issue date Sep 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng Lien
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer back-side polishing system and method for integrated circuit...
- Patent number 9,287,127
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Nan Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Barc-assisted process for planar recessing or removing of variable-...
- Patent number 9,236,446
- Issue date Jan 12, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Kuei Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EXHAUST PIPING FOR A SEMICONDUCTOR PROCESSING TOOL
- Publication number 20230065093
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Sheng LIEN
- B08 - CLEANING
Information Patent Application
CMP Slurry Solution for Hardened Fluid Material
- Publication number 20200407594
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Yin Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR ADJUSTING ETCHING PARAMETERS
- Publication number 20180151454
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Sheng LIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP-FRIENDLY COATINGS FOR PLANAR RECESSING OR REMOVING OF VARIABLE...
- Publication number 20170352548
- Publication date Dec 7, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Kuei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP Slurry Solution for Hardened Fluid Material
- Publication number 20170158914
- Publication date Jun 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Yin Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT...
- Publication number 20170125237
- Publication date May 4, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Shen-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT...
- Publication number 20160190023
- Publication date Jun 30, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Shen-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP-FRIENDLY COATINGS FOR PLANAR RECESSING OR REMOVING OF VARIABLE...
- Publication number 20160172209
- Publication date Jun 16, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Kuei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARC-ASSISTED PROCESS FOR PLANAR RECESSING OR REMOVING OF VARIABLE...
- Publication number 20160099157
- Publication date Apr 7, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Kuei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP SLURRY SOLUTION FOR HARDENED FLUID MATERIAL
- Publication number 20150307747
- Publication date Oct 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Yin Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BARC-ASSISTED PROCESS FOR PLANAR RECESSING OR REMOVING OF VARIABLE...
- Publication number 20150263132
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Kuei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT...
- Publication number 20150235858
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Shen-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Retainer Ring
- Publication number 20140134929
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng Lien
- B24 - GRINDING POLISHING

Kuo-Cheng Lien

Person

Patents Grantslast 30 patents

CMP slurry solution for hardened fluid material

CMP-friendly coatings for planar recessing or removing of variable-...

CMP slurry solution for hardened fluid material

Method for adjusting etching parameters

Wafer back-side polishing system and method for integrated circuit...

CMP-friendly coatings for planar recessing or removing of variable-...

CMP slurry solution for hardened fluid material

Wafer back-side polishing system and method for integrated circuit...

BARC-assisted process for planar recessing or removing of variable-...

Retainer ring

Wafer back-side polishing system and method for integrated circuit...

Barc-assisted process for planar recessing or removing of variable-...

Patents Applicationslast 30 patents

EXHAUST PIPING FOR A SEMICONDUCTOR PROCESSING TOOL

CMP Slurry Solution for Hardened Fluid Material

METHOD FOR ADJUSTING ETCHING PARAMETERS

CMP-FRIENDLY COATINGS FOR PLANAR RECESSING OR REMOVING OF VARIABLE...

CMP Slurry Solution for Hardened Fluid Material

WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT...

WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT...

CMP-FRIENDLY COATINGS FOR PLANAR RECESSING OR REMOVING OF VARIABLE...

BARC-ASSISTED PROCESS FOR PLANAR RECESSING OR REMOVING OF VARIABLE...

CMP SLURRY SOLUTION FOR HARDENED FLUID MATERIAL

BARC-ASSISTED PROCESS FOR PLANAR RECESSING OR REMOVING OF VARIABLE...

WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT...

Retainer Ring