Kuo-Chi Liu

Person

HsinChu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 12,218,074
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase switching converter and control method thereof
- Patent number 12,199,507
- Issue date Jan 14, 2025
- Richtek Technology Corporation
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Switched capacitor voltage converter circuit and control method of...
- Patent number 12,199,506
- Issue date Jan 14, 2025
- Richtek Technology Corporation
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multi-phase switching converter and control method thereof
- Patent number 12,199,516
- Issue date Jan 14, 2025
- Richtek Technology Corporation
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,183,805
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhi-Qiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switched capacitor voltage converter circuit and switched capacitor...
- Patent number 12,184,168
- Issue date Dec 31, 2024
- Richtek Technology Corporation
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Chip package structure with ring-like structure
- Patent number 12,183,709
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for performing extreme ultraviolet photolithograp...
- Patent number 12,174,545
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-Yu Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Switched capacitor voltage converter circuit and switched capacitor...
- Patent number 12,176,811
- Issue date Dec 24, 2024
- Richtek Technology Corporation
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Switched capacitor voltage converter circuit
- Patent number 12,136,876
- Issue date Nov 5, 2024
- Richtek Technology Corporation
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Switched capacitor voltage converter circuit and switched capacitor...
- Patent number 12,136,877
- Issue date Nov 5, 2024
- RICHTEK TECHNOLPGY CORPORATION
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Fin Field-Effect Transistor and method of forming the same
- Patent number 12,136,624
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Duen-Huei Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switched capacitor voltage converter circuit and switched capacitor...
- Patent number 12,136,875
- Issue date Nov 5, 2024
- Richtek Technology Corporation
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Reduction of cracks in passivation layer
- Patent number 12,087,714
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor die having edge with multiple grad...
- Patent number 12,087,618
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active region cut process
- Patent number 12,080,603
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure
- Patent number 12,046,588
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of wireless chargers with power lines
- Patent number 11,967,852
- Issue date Apr 23, 2024
- Hewlett-Packard Development Company, L.P.
- Kuo-Hsien Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Automated inspection tool
- Patent number 11,961,770
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Han Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resonant switching power converter circuit
- Patent number 11,955,884
- Issue date Apr 9, 2024
- Richtek Technology Corporation
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Interconnect structure and forming method thereof
- Patent number 11,955,441
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless polling frequency alteration
- Patent number 11,949,256
- Issue date Apr 2, 2024
- Hewlett-Packard Development Company, L.P.
- Kuo-Hsien Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with ring-like structure
- Patent number 11,848,302
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,830,948
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation circuit having test mechanism and test method thereof
- Patent number 11,774,497
- Issue date Oct 3, 2023
- Realtek Semiconductor Corporation
- Kuo-Kai Liu
- G01 - MEASURING TESTING
Information Patent Grant
Method for transceiving signals and transceiver using the same
- Patent number 11,777,552
- Issue date Oct 3, 2023
- Leltek Inc.
- Biyun Yeh
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
System and method for performing extreme ultraviolet photolithograp...
- Patent number 11,768,437
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-Yu Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
MODIFYING TSV LAYOUT AND THE STRUCTURES THEREOF
- Publication number 20250046655
- Publication date Feb 6, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Chao Yi Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF
- Publication number 20250015007
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilevel Buck Converter with Valley Current Mode Control and Dual...
- Publication number 20240413749
- Publication date Dec 12, 2024
- RICHTEK TECHNOLOGY CORP.
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTI-LEVEL SWITCHING CONVERTER CIRCUIT AND MULTI-LEVEL SWITCHING C...
- Publication number 20240405683
- Publication date Dec 5, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- Publication number 20240387548
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Duen-Huei Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF CRACKS IN PASSIVATION LAYER
- Publication number 20240379593
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-An Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE REGION CUT PROCESS
- Publication number 20240371697
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PHASE CONVERSION CIRCUIT AND CONTROL METHOD THEREOF
- Publication number 20240372467
- Publication date Nov 7, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS
- Publication number 20240363398
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE
- Publication number 20240355795
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING RING STRUCTURE ATTACHED BY HYBRID ADHES...
- Publication number 20240332212
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PHASE SWITCHING CONVERTER AND CONTROL METHOD THEREOF
- Publication number 20240297580
- Publication date Sep 5, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...
- Publication number 20240290683
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PHASE SWITCHING CONVERTER AND CONTROL METHOD THEREOF
- Publication number 20240235370
- Publication date Jul 11, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
BUCK-BOOST SWITCHING CONVERTER AND CONTROL METHOD THEREOF
- Publication number 20240223086
- Publication date Jul 4, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Kuo-Chi Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240213180
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS POLLING FREQUENCY ALTERATION
- Publication number 20240128804
- Publication date Apr 18, 2024
- Hewlett-Packard Development Company, L.P.
- Kuo-Hsien Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE
- Publication number 20240120313
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC IN...
- Publication number 20240096818
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240087947
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240071854
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240071950
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT SWITCHED CAPACITOR VOLTAGE CONVERTER AND CONTROL METHOD TH...
- Publication number 20240072633
- Publication date Feb 29, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Kuo-Chi LIU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CONTROL CIRCUIT AND METHOD FOR USE IN STACKABLE MULTIPHASE POWER CO...
- Publication number 20240063720
- Publication date Feb 22, 2024
- RICHTEK TECHNOLOGY CORPORATION
- Ta-Yung YANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240055527
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF WIRELESS CHARGERS WITH POWER LINES
- Publication number 20240030736
- Publication date Jan 25, 2024
- Hewlett-Packard Development Company, L.P.
- Kuo-Hsien LIU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230411307
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230395461
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Kuo-Chi Liu

Person

Patents Grantslast 30 patents

DC and AC magnetic field protection for MRAM device using magnetic-...

Multi-phase switching converter and control method thereof

Switched capacitor voltage converter circuit and control method of...

Multi-phase switching converter and control method thereof

Semiconductor device and manufacturing method thereof

Switched capacitor voltage converter circuit and switched capacitor...

Chip package structure with ring-like structure

System and method for performing extreme ultraviolet photolithograp...

Switched capacitor voltage converter circuit and switched capacitor...

Switched capacitor voltage converter circuit

Switched capacitor voltage converter circuit and switched capacitor...

Fin Field-Effect Transistor and method of forming the same

Switched capacitor voltage converter circuit and switched capacitor...

Reduction of cracks in passivation layer

Method for forming semiconductor die having edge with multiple grad...

Active region cut process

Package and package-on-package structure having elliptical columns...

Package on package structure

Package structure with a barrier layer

Control of wireless chargers with power lines

Automated inspection tool

Resonant switching power converter circuit

Interconnect structure and forming method thereof

Wireless polling frequency alteration

LTHC as charging barrier in info package formation

Chip package structure with ring-like structure

Semiconductor device and manufacturing method thereof

Isolation circuit having test mechanism and test method thereof

Method for transceiving signals and transceiver using the same

System and method for performing extreme ultraviolet photolithograp...

Patents Applicationslast 30 patents

MODIFYING TSV LAYOUT AND THE STRUCTURES THEREOF

VIA ARRAY IN A REDISTRIBUTION LAYER STRUCTURE FOR STRESS RELIEF

Multilevel Buck Converter with Valley Current Mode Control and Dual...

MULTI-LEVEL SWITCHING CONVERTER CIRCUIT AND MULTI-LEVEL SWITCHING C...

FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

REDUCTION OF CRACKS IN PASSIVATION LAYER

ACTIVE REGION CUT PROCESS

MULTI-PHASE CONVERSION CIRCUIT AND CONTROL METHOD THEREOF

SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS

PACKAGE ON PACKAGE STRUCTURE

PACKAGE STRUCTURE INCLUDING RING STRUCTURE ATTACHED BY HYBRID ADHES...

MULTI-PHASE SWITCHING CONVERTER AND CONTROL METHOD THEREOF

PACKAGE STRUCTURE WITH A BARRIER LAYER

PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...

MULTI-PHASE SWITCHING CONVERTER AND CONTROL METHOD THEREOF

BUCK-BOOST SWITCHING CONVERTER AND CONTROL METHOD THEREOF

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

WIRELESS POLLING FREQUENCY ALTERATION

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC IN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

MULTI-DIE PACKAGE AND METHODS OF FORMATION

Integrated Circuit Packages and Methods of Forming the Same

RESONANT SWITCHED CAPACITOR VOLTAGE CONVERTER AND CONTROL METHOD TH...

CONTROL CIRCUIT AND METHOD FOR USE IN STACKABLE MULTIPHASE POWER CO...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

CONTROL OF WIRELESS CHARGERS WITH POWER LINES

Semiconductor Device and Method Forming Same

Semiconductor Device and Method Forming Same