Membership
Tour
Register
Log in
Kuo-Chih Lee
Follow
Person
Kaohsiung City, TW
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Multi-chip stacking method to reduce voids between stacked chips
Patent number
8,815,645
Issue date
Aug 26, 2014
Walton Advanced Engineering, Inc.
Kuo-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mold array process method to encapsulate substrate cut edges
Patent number
8,361,841
Issue date
Jan 29, 2013
Walton Advanced Engineering, Inc.
Kuo-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip stacking method to reduce voids between stacked chips
Patent number
8,093,104
Issue date
Jan 10, 2012
Walton Advanced Engineering, Inc.
Kuo-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package fabricated by cutting and molding in small wi...
Patent number
7,768,112
Issue date
Aug 3, 2010
WALTON ADVANCED ENGINEERING INC.
Kuo-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for cutting and molding in small windows to fabricate semico...
Patent number
7,723,157
Issue date
May 25, 2010
Walton Advanced Engineering, Inc.
Kuo-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat dissipation module for a BGA IC
Patent number
6,486,564
Issue date
Nov 26, 2002
Walsin Advanced Electronics Ltd.
Wen-Chun Liu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MOLD ARRAY PROCESS METHOD TO ENCAPSULATE SUBSTRATE CUT EDGES
Publication number
20120270368
Publication date
Oct 25, 2012
Kuo-Yuan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES
Publication number
20120264257
Publication date
Oct 18, 2012
Kuo-Yuan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND APPARATUS OF COMPRESSION MOLDING TO REDUCE VOIDS IN MOLD...
Publication number
20120187598
Publication date
Jul 26, 2012
Kuo-Yuan LEE
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
MULTI-CHIP STACKING METHOD TO REDUCE VOIDS BETWEEN STACKED CHIPS
Publication number
20120115277
Publication date
May 10, 2012
WALTON ADVANCED ENGINEERING INC.
Kuo-Yuan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP BONDING METHOD TO REDUCE VOIDS IN UNDERFILL MATERIAL
Publication number
20120077312
Publication date
Mar 29, 2012
Kuo-Yuan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WINDOW TYPE SEMICONDUCTOR PACKAGE
Publication number
20100219521
Publication date
Sep 2, 2010
Kuo-Yuan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE FABRICATED BY CUTTING AND MOLDING IN SMALL WI...
Publication number
20090302446
Publication date
Dec 10, 2009
Kuo-Yuan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARD TYPE MEMORY PACKAGE
Publication number
20090294792
Publication date
Dec 3, 2009
Walton Advanced Engineering, Inc.
Kuo-Yuan Lee
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Cutting and molding in small windows to fabricate semiconductor pac...
Publication number
20090166891
Publication date
Jul 2, 2009
Walton Advanced Engineering Inc.
Kuo-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package and packaging method for balancing top and bo...
Publication number
20090134504
Publication date
May 28, 2009
Walton Advanced Engineering, Inc.
Kuo-Yuan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for manufacturing decorative articles
Publication number
20060138695
Publication date
Jun 29, 2006
Kuo-Chih Lee
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Heat dissipation module for a BGA IC
Publication number
20020020926
Publication date
Feb 21, 2002
Wen-Chun Liu
H01 - BASIC ELECTRIC ELEMENTS