Kuo-Chyuan Tzeng

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Back-side deep trench isolation structure for image sensor
- Patent number 12,211,877
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change memory device and method for manufacturing the same
- Patent number 12,048,258
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Tai Tseng
Information Patent Grant
Back-side deep trench isolation structure for image sensor
- Patent number 11,955,496
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thin semiconductor-on-insulator (SOI) substrates
- Patent number 11,855,159
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bit line and word line connection for memory array
- Patent number 11,715,519
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Chih Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Self-aligned double patterning process and semiconductor structure...
- Patent number 11,676,822
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer in memory cell to prevent metal redeposition
- Patent number 11,532,785
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chiang Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays including continuous line-shaped random access memory...
- Patent number 11,404,480
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Tzu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thin semiconductor-on-insulator (SOI) substrates
- Patent number 11,264,469
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bit line and word line connection for memory array
- Patent number 11,211,120
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Chih Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
SOI substrate, semiconductor device and method for manufacturing th...
- Patent number 11,164,945
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and manufacturing met...
- Patent number 11,087,971
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having carrier-trapping layers with...
- Patent number 11,063,117
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned double patterning (SADP) method
- Patent number 10,872,777
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jui-Yu Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned double patterning process and semiconductor structure...
- Patent number 10,818,505
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thin semiconductor-on-insulator (SOI) substrates
- Patent number 10,658,474
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and manufacturing met...
- Patent number 10,504,716
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yung-Lung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned double patterning (SADP) method
- Patent number 10,483,119
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Yu Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI substrate, semiconductor device and method for manufacturing th...
- Patent number 10,468,486
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming trench liner passivation
- Patent number 10,204,822
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench liner passivation for dark current improvement
- Patent number 9,917,003
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling MIM capacitor designs for interposers and methods of man...
- Patent number 9,401,395
- Issue date Jul 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chyuan Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dielectric constant structure for the vertical transfer gates...
- Patent number 9,281,331
- Issue date Mar 8, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor within topmost thick inter-me...
- Patent number 9,269,762
- Issue date Feb 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chyuan Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling MIM capacitor designs for interposers and methods of man...
- Patent number 9,263,415
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chyuan Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling MIM capacitor designs for interposers and methods of man...
- Patent number 9,257,409
- Issue date Feb 9, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chyuan Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structures
- Patent number 9,245,792
- Issue date Jan 26, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Kuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etch-back process for semiconductor devices
- Patent number 9,159,808
- Issue date Oct 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Kuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor within topmost thick inter-me...
- Patent number 8,994,146
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chyuan Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating metal-insulator-metal (MIM) capacitor within...
- Patent number 8,993,405
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chyuan Tzeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20240379712
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240349630
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Tai TSENG
Information Patent Application
PHASE CHANGE MATERIAL SWITCH WITH EFFICIENT HEAT SPREADER AND METHO...
- Publication number 20240276897
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Yu CHEN
Information Patent Application
PHASE-CHANGE DEVICE STRUCTURE
- Publication number 20240057346
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Ting Sung
Information Patent Application
PCM DEVICE
- Publication number 20240008373
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL CONFINEMENT AND...
- Publication number 20230403954
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION-LESS PHASE CHANGE MATERIAL SWITCH
- Publication number 20230397511
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20230387170
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED PHASE CHANGE MATERIAL SWITCH AND METHODS FOR FORMING T...
- Publication number 20230389449
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Hsueh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIT LINE AND WORD LINE CONNECTION FOR MEMORY ARRAY
- Publication number 20230326522
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chih Huang
- G11 - INFORMATION STORAGE
Information Patent Application
BUFFER LAYER IN MEMORY CELL TO PREVENT METAL REDEPOSITION
- Publication number 20230100433
- Publication date Mar 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Chiang Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT FOR REDUCING LOADING AT LINE SOCKETS AND/OR FOR INCREASING O...
- Publication number 20230043884
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Including Continuous Line-Shaped Random Access Memory...
- Publication number 20220336530
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Tzu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220293854
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Tai TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES
- Publication number 20220238662
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER LAYER IN MEMORY CELL TO PREVENT METAL REDEPOSITION
- Publication number 20220123207
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIT LINE AND WORD LINE CONNECTION FOR MEMORY ARRAY
- Publication number 20220115066
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chih Huang
- G11 - INFORMATION STORAGE
Information Patent Application
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20220102397
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...
- Publication number 20210358740
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-LUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIT LINE AND WORD LINE CONNECTION FOR MEMORY ARRAY
- Publication number 20210295912
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chang-Chih Huang
- G11 - INFORMATION STORAGE
Information Patent Application
Line-Shaped Memory and Method Forming Same
- Publication number 20210202579
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Tzu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED DOUBLE PATTERNING PROCESS AND SEMICONDUCTOR STRUCTURE...
- Publication number 20210035809
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES
- Publication number 20200258989
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED DOUBLE PATTERNING (SADP) METHOD
- Publication number 20200098580
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jui-Yu Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...
- Publication number 20200083036
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-LUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES
- Publication number 20200058746
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20200058737
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHENG-TA WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED DOUBLE PATTERNING PROCESS AND SEMICONDUCTOR STRUCTURE...
- Publication number 20200058514
- Publication date Feb 20, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...
- Publication number 20190287788
- Publication date Sep 19, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- YUNG-LUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20190131400
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHENG-TA WU
- H01 - BASIC ELECTRIC ELEMENTS

Kuo-Chyuan Tzeng

Person

Patents Grantslast 30 patents

Back-side deep trench isolation structure for image sensor

Phase change memory device and method for manufacturing the same

Back-side deep trench isolation structure for image sensor

Method for forming thin semiconductor-on-insulator (SOI) substrates

Bit line and word line connection for memory array

Self-aligned double patterning process and semiconductor structure...

Buffer layer in memory cell to prevent metal redeposition

Memory arrays including continuous line-shaped random access memory...

Method for forming thin semiconductor-on-insulator (SOI) substrates

Bit line and word line connection for memory array

SOI substrate, semiconductor device and method for manufacturing th...

Method for manufacturing semiconductor device and manufacturing met...

Semiconductor device structure having carrier-trapping layers with...

Self-aligned double patterning (SADP) method

Self-aligned double patterning process and semiconductor structure...

Method for forming thin semiconductor-on-insulator (SOI) substrates

Method for manufacturing semiconductor device and manufacturing met...

Self-aligned double patterning (SADP) method

SOI substrate, semiconductor device and method for manufacturing th...

Method for forming trench liner passivation

Trench liner passivation for dark current improvement

Decoupling MIM capacitor designs for interposers and methods of man...

High dielectric constant structure for the vertical transfer gates...

Metal-insulator-metal (MIM) capacitor within topmost thick inter-me...

Decoupling MIM capacitor designs for interposers and methods of man...

Decoupling MIM capacitor designs for interposers and methods of man...

Method for forming interconnect structures

Selective etch-back process for semiconductor devices

Metal-insulator-metal (MIM) capacitor within topmost thick inter-me...

Method of fabricating metal-insulator-metal (MIM) capacitor within...

Patents Applicationslast 30 patents

BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

PHASE CHANGE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

PHASE CHANGE MATERIAL SWITCH WITH EFFICIENT HEAT SPREADER AND METHO...

PHASE-CHANGE DEVICE STRUCTURE

PCM DEVICE

PHASE CHANGE MATERIAL SWITCH WITH IMPROVED THERMAL CONFINEMENT AND...

PLANARIZATION-LESS PHASE CHANGE MATERIAL SWITCH

BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

ENCAPSULATED PHASE CHANGE MATERIAL SWITCH AND METHODS FOR FORMING T...

BIT LINE AND WORD LINE CONNECTION FOR MEMORY ARRAY

BUFFER LAYER IN MEMORY CELL TO PREVENT METAL REDEPOSITION

LAYOUT FOR REDUCING LOADING AT LINE SOCKETS AND/OR FOR INCREASING O...

Memory Arrays Including Continuous Line-Shaped Random Access Memory...

PHASE CHANGE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES

BUFFER LAYER IN MEMORY CELL TO PREVENT METAL REDEPOSITION

BIT LINE AND WORD LINE CONNECTION FOR MEMORY ARRAY

BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...

BIT LINE AND WORD LINE CONNECTION FOR MEMORY ARRAY

Line-Shaped Memory and Method Forming Same

SELF-ALIGNED DOUBLE PATTERNING PROCESS AND SEMICONDUCTOR STRUCTURE...

METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES

SELF-ALIGNED DOUBLE PATTERNING (SADP) METHOD

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...

METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES

SOI SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING TH...

SELF-ALIGNED DOUBLE PATTERNING PROCESS AND SEMICONDUCTOR STRUCTURE...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING MET...

SOI SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING TH...