Kuo-Hua Chang

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Zhongli City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming metal bumps
- Patent number 7,550,375
- Issue date Jun 23, 2009
- Advanced Semiconductor Engineering Inc.
- Sheng-Ming Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for forming metal bumps
- Publication number 20070232051
- Publication date Oct 4, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Sheng-Ming Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming metal bumps
- Publication number 20070218676
- Publication date Sep 20, 2007
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Sheng-Ming Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR