Kuo-Hua Lai

Follow

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,588,470
- Issue date Feb 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package structure
- Patent number 11,296,651
- Issue date Apr 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure
- Patent number 10,812,017
- Issue date Oct 20, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20230208394
- Publication date Jun 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210257988
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210036658
- Publication date Feb 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY