TREA

Kuo-Lung Hou

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  • Taichung, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Apparatus and methods for determining horizontal position of substr...
    • Patent number 12,087,625
    • Issue date Sep 10, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Kuo-Lung Hou
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Physical vapor deposition apparatus
    • Patent number 12,077,850
    • Issue date Sep 3, 2024
    • Taiwan Semiconductor Manufacturing Company Ltd.
    • Kuo-Lung Hou
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Apparatus for electro-chemical plating
    • Patent number 12,071,699
    • Issue date Aug 27, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd
    • Kuo-Lung Hou
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating system and method of plating wafer
    • Patent number 12,071,701
    • Issue date Aug 27, 2024
    • Taiwan Semiconductor Manufacturing Company Limited
    • Kuo-Lung Hou
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Apparatus for electro-chemical plating
    • Patent number 12,020,922
    • Issue date Jun 25, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Kuo-Lung Hou
    • B08 - CLEANING
  • Information Patent Grant

    Plating system and method of plating wafer
    • Patent number 11,634,832
    • Issue date Apr 25, 2023
    • Taiwan Semiconductor Manufacturing Company Limited
    • Kuo-Lung Hou
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Apparatus for electro-chemical plating
    • Patent number 11,427,924
    • Issue date Aug 30, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Kuo-Lung Hou
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    APPARATUSES AND SYSTEMS FOR ELECTROPLATING
    • Publication number 20240363406
    • Publication date Oct 31, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuo-Lung HOU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    METHODS OF ELECTROCHEMICAL PLATING
    • Publication number 20240360585
    • Publication date Oct 31, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuo-Lung HOU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING SYSTEM AND METHOD OF PLATING WAFER
    • Publication number 20240360584
    • Publication date Oct 31, 2024
    • Taiwan Semiconductor Manufacturing Company Limited
    • Kuo-Lung HOU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    CRYOGENIC PUMP FOR SEMICONDUCTOR PROCESSING
    • Publication number 20240337265
    • Publication date Oct 10, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu Min CHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    APPARATUS FOR ELECTRO-CHEMICAL PLATING
    • Publication number 20230386824
    • Publication date Nov 30, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuo-Lung HOU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PLATING SYSTEM AND METHOD OF PLATING WAFER
    • Publication number 20230257901
    • Publication date Aug 17, 2023
    • Taiwan Semiconductor Manufacturing Company Limited
    • Kuo-Lung HOU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    PHYSICAL VAPOR DEPOSITION APPARATUS
    • Publication number 20230041439
    • Publication date Feb 9, 2023
    • Taiwan Semiconductor Manufacturing company Ltd.
    • Kuo-Lung Hou
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    PLATING SYSTEM AND METHOD OF PLATING WAFER
    • Publication number 20220356596
    • Publication date Nov 10, 2022
    • Taiwan Semiconductor Manufacturing Company Limited
    • Kuo-Lung HOU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    APPARATUS FOR ELECTRO-CHEMICAL PLATING
    • Publication number 20220356597
    • Publication date Nov 10, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuo-Long HOU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    APPARATUS AND METHODS FOR DETERMINING HORIZONTAL POSITION OF SUBSTR...
    • Publication number 20220352021
    • Publication date Nov 3, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Kuo-Lung HOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    APPARATUS AND METHODS FOR DETERMINING HORIZONTAL POSITION OF SUBSTR...
    • Publication number 20220336272
    • Publication date Oct 20, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Kuo-Lung HOU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    APPARATUS FOR ELECTRO-CHEMICAL PLATING
    • Publication number 20220336211
    • Publication date Oct 20, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Kuo-Lung HOU
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR