Kuo-Lung Lei

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming copper bump antioxidation surface
- Patent number 7,008,867
- Issue date Mar 7, 2006
- Aptos Corporation
- Kuo Lung Lei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMS micro-cap wafer level chip scale package
- Publication number 20040256719
- Publication date Dec 23, 2004
- Aptos Corporation
- Kuo-Lung Lei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for forming copper bump antioxidation surface
- Publication number 20040166661
- Publication date Aug 26, 2004
- Aptos Corporation
- Kuo Lung Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS wafer level chip scale package
- Publication number 20040166662
- Publication date Aug 26, 2004
- Aptos Corporation
- Kuo-Lung Lei
- B81 - MICRO-STRUCTURAL TECHNOLOGY