Kuo-Lung Pan

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having different source/drain junction depths...
- Patent number 12,336,282
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Lin
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,324,235
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-San Chien
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 12,317,567
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Lin
Information Patent Grant
Isolation structure for preventing unintentional merging of epitaxi...
- Patent number 12,300,698
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,300,571
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact
- Patent number 12,288,822
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure including a barrier s...
- Patent number 12,278,208
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods of forming the same
- Patent number 12,266,653
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding passive devices on active dies to form 3D packages
- Patent number 12,255,174
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with source/drain structure and meth...
- Patent number 12,205,849
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,183,810
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,183,735
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with uniform threshold voltage distr...
- Patent number 12,087,844
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for FinFET device with source/drain modulation
- Patent number 12,080,607
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structures
- Patent number 12,074,057
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ta-Chun Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packages with thick RDLs and thin RDLs stacked alternatingly
- Patent number 12,057,405
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around (GAA) method and devices
- Patent number 12,057,485
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shien-Yang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method of package structure the...
- Patent number 12,051,666
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having gate dielectric layers of varying thic...
- Patent number 12,051,695
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure
- Patent number 12,029,025
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure including a silicon substrate interposer and...
- Patent number 12,014,976
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,014,979
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,009,281
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing parasitic capacitance in field-effect transistors
- Patent number 11,996,320
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure for isolating epitaxially grown source/drain re...
- Patent number 11,990,525
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having support rings
- Patent number 11,990,381
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate spacers and methods of forming the same in semiconductor devices
- Patent number 11,967,532
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250227986
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun Lin
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250219010
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD
- Publication number 20250096163
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250096203
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250081497
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih KAO
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20250081602
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun Lin
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250031358
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Sheng YU
Information Patent Application
BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES
- Publication number 20240395769
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240371726
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES
- Publication number 20240363397
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Ta-Chun Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device Structure With Uniform Threshold Voltage Distr...
- Publication number 20240363731
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Chih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR FINFET DEVICE WITH SOURCE/DRAIN MODULATION
- Publication number 20240363435
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING GATE-ALL-AROUND (GAA) DEVICES
- Publication number 20240355896
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shien-Yang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY
- Publication number 20240355754
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...
- Publication number 20240339427
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20240334671
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING PARASITIC CAPACITANCE IN FIELD-EFFECT TRANSISTORS
- Publication number 20240312832
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE FOR ISOLATING EPITAXIALLY GROWN SOURCE/DRAIN RE...
- Publication number 20240313072
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES
- Publication number 20240297114
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...
- Publication number 20240290703
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE WITH ARCHED TOP SURFACE AND FABRICATION METHOD TH...
- Publication number 20240266412
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ruoh-Ning TZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE SPACERS AND METHODS OF FORMING THE SAME IN SEMICONDUCTOR DEVICES
- Publication number 20240266224
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL BLOCKING LAYER FOR MULTI-GATE DEVICES AND FABRICATION MET...
- Publication number 20240266167
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Che CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240203936
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
- Publication number 20240194525
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH EXTENDED CONTACT STRUCTURE
- Publication number 20240170537
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND...
- Publication number 20240120337
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240113071
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240079447
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20240071981
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS

Kuo-Lung Pan

Person

Patents Grantslast 30 patents

Semiconductor device having different source/drain junction depths...

Chip package and method of forming the same

Semiconductor device and method of forming the same

Semiconductor device structure and method for forming the same

Isolation structure for preventing unintentional merging of epitaxi...

Integrated circuit package and method

Semiconductor device with source/drain contact

Method of fabricating semiconductor structure including a barrier s...

Semiconductor structure and methods of forming the same

Bonding passive devices on active dies to form 3D packages

Semiconductor device structure with source/drain structure and meth...

Integrated circuit structure and method

Semiconductor devices and methods of manufacture

Semiconductor devices and methods of manufacture

Semiconductor package and manufacturing method of semiconductor pac...

Semiconductor device structure with uniform threshold voltage distr...

Structure and method for FinFET device with source/drain modulation

Isolation structures

Packages with thick RDLs and thin RDLs stacked alternatingly

Gate-all-around (GAA) method and devices

Package structure and manufacturing method of package structure the...

Semiconductor devices having gate dielectric layers of varying thic...

Semiconductor device structure

Chip package structure including a silicon substrate interposer and...

Methods of forming semiconductor packages

Package structure and method of manufacturing the same

Reducing parasitic capacitance in field-effect transistors

Isolation structure for isolating epitaxially grown source/drain re...

Integrated circuit packages having support rings

Gate spacers and methods of forming the same in semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE

INTEGRATED CIRCUIT STRUCTURE AND METHOD

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE

BONDING PASSIVE DEVICES ON ACTIVE DIES TO FORM 3D PACKAGES

Integrated Circuit Package and Method

ISOLATION STRUCTURES

Semiconductor Device Structure With Uniform Threshold Voltage Distr...

STRUCTURE AND METHOD FOR FINFET DEVICE WITH SOURCE/DRAIN MODULATION

METHODS OF FORMING GATE-ALL-AROUND (GAA) DEVICES

PACKAGES WITH THICK RDLS AND THIN RDLS STACKED ALTERNATINGLY

MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THE...

SEMICONDUCTOR DEVICE STRUCTURE

REDUCING PARASITIC CAPACITANCE IN FIELD-EFFECT TRANSISTORS

ISOLATION STRUCTURE FOR ISOLATING EPITAXIALLY GROWN SOURCE/DRAIN RE...

METHODS OF FORMING SEMICONDUCTOR PACKAGES

CHIP PACKAGE STRUCTURE INCLUDING A SILICON SUBSTRATE INTERPOSER AND...

CONTACT STRUCTURE WITH ARCHED TOP SURFACE AND FABRICATION METHOD TH...

GATE SPACERS AND METHODS OF FORMING THE SAME IN SEMICONDUCTOR DEVICES

EPITAXIAL BLOCKING LAYER FOR MULTI-GATE DEVICES AND FABRICATION MET...

SEMICONDUCTOR STRUCTURE

Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof

SEMICONDUCTOR STRUCTURE WITH EXTENDED CONTACT STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FORKSHEET TRANSISTORS AND...

Integrated Circuit Package and Method

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE