Kuo-Ning Chiang

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Yangmei Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional multichip stack electronic package structure
- Patent number 7,211,886
- Issue date May 1, 2007
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Three-dimensional multichip stack electronic package structure
- Publication number 20060273439
- Publication date Dec 7, 2006
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional multichip stack electronic package structure
- Publication number 20050224947
- Publication date Oct 13, 2005
- Industrial Technology Research Institute
- Yung-Yu Hsu
- H01 - BASIC ELECTRIC ELEMENTS