Kuo-Wei Li

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Taipei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board structure
- Patent number 11,600,936
- Issue date Mar 7, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board structure
- Patent number 11,114,782
- Issue date Sep 7, 2021
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE HAVING SOLDER MASK LAYER WITH LOW DIELECTRIC CONS...
- Publication number 20220240367
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Ming-Hao WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210273356
- Publication date Sep 2, 2021
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200366012
- Publication date Nov 19, 2020
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MULTILAYER FLEXIBLE CIRCUIT STRUCTURE
- Publication number 20160073505
- Publication date Mar 10, 2016
- Unimicron Technology Corp.
- Cheng-Po Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR