Kuo-Wei Liu

Person

Campbell, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 7,560,377
- Issue date Jul 14, 2009
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,930,061
- Issue date Aug 16, 2005
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,869,896
- Issue date Mar 22, 2005
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,734,115
- Issue date May 11, 2004
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,660,656
- Issue date Dec 9, 2003
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low dielectric constant carbon doped silicon o...
- Patent number 6,632,735
- Issue date Oct 14, 2003
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,596,655
- Issue date Jul 22, 2003
- Applied Materials Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,562,690
- Issue date May 13, 2003
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,541,282
- Issue date Apr 1, 2003
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,348,725
- Issue date Feb 19, 2002
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processes for depositing low dielectric constant films
- Patent number 6,303,523
- Issue date Oct 16, 2001
- Applied Materials, Inc.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Methods of Soldering to High Efficiency Thin Film Solar Panels
- Publication number 20120088327
- Publication date Apr 12, 2012
- Applied Materials, Inc.
- Adam Brand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20050191846
- Publication date Sep 1, 2005
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20040082199
- Publication date Apr 29, 2004
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20040038545
- Publication date Feb 26, 2004
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20030064610
- Publication date Apr 3, 2003
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low dielectric constant carbon doped silicon o...
- Publication number 20030032305
- Publication date Feb 13, 2003
- APPLIED MATERIALS, INC.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma processes for depositing low dielectric constant films
- Publication number 20020045361
- Publication date Apr 18, 2002
- APPLIED MATERIALS, INC.
- David Cheung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS
- Publication number 20010005546
- Publication date Jun 28, 2001
- APPLIED MATERIALS, INC.
- DAVID CHEUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kuo-Wei Liu

Person

Patents Grantslast 30 patents

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Method of depositing low dielectric constant carbon doped silicon o...

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Patents Applicationslast 30 patents

Methods of Soldering to High Efficiency Thin Film Solar Panels

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Plasma processes for depositing low dielectric constant films

Method of depositing low dielectric constant carbon doped silicon o...

Plasma processes for depositing low dielectric constant films

PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS