Kuolung (Dino) LEI

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Water proofing and water detection schemes for MEMS-based environme...
- Patent number 11,305,984
- Issue date Apr 19, 2022
- Apple Inc.
- Krishna Prasad Vummidi Murali
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Water proofing and water detection schemes for MEMS-based environme...
- Patent number 10,640,367
- Issue date May 5, 2020
- Apple Inc.
- Krishna Prasad Vummidi Murali
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Non-contact temperature measurement sensor
- Patent number 10,436,647
- Issue date Oct 8, 2019
- Maxim Integrated Products, Inc.
- Jerome C. Bhat
- G01 - MEASURING TESTING
Information Patent Grant
Non-contact temperature measurement sensor
- Patent number 10,113,915
- Issue date Oct 30, 2018
- Maxim Integrated Products, Inc.
- Jerome C. Bhat
- G01 - MEASURING TESTING
Information Patent Grant
Reduction of chipping damage to MEMS structure
- Patent number 9,738,511
- Issue date Aug 22, 2017
- Invensense, Inc.
- Jongwoo Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of packaging microelectromechanical resonators
- Patent number 8,426,233
- Issue date Apr 23, 2013
- Integrated Device Technology, Inc.
- Kuolung Lei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming packaged micro-electromechanical devices
- Patent number 7,955,885
- Issue date Jun 7, 2011
- Integrated Device Technology, Inc.
- Harmeet Bhugra
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming multi-chip semiconductor substrates
- Patent number 7,871,857
- Issue date Jan 18, 2011
- Integrated Device Technology, Inc.
- Kuolung Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic packaging substrates having thro...
- Patent number 7,842,613
- Issue date Nov 30, 2010
- Integrated Device Technology, Inc.
- Kuolung Lei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flexible multi-chip module and method of making the same
- Patent number 7,141,875
- Issue date Nov 28, 2006
- Aptos Corp
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat-top bumping structure and preparation method
- Patent number 6,784,089
- Issue date Aug 31, 2004
- Aptos Corporation
- Kuolung Lei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WATER PROOFING AND WATER DETECTION SCHEMES FOR MEMS-BASED ENVIRONME...
- Publication number 20200223686
- Publication date Jul 16, 2020
- Apple Inc.
- Krishna Prasad VUMMIDI MURALI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WATER PROOFING AND WATER DETECTION SCHEMES FOR MEMS-BASED ENVIRONME...
- Publication number 20190100428
- Publication date Apr 4, 2019
- Apple Inc.
- Krishna Prasad VUMMIDI MURALI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NON-CONTACT TEMPERATURE MEASUREMENT SENSOR
- Publication number 20190101454
- Publication date Apr 4, 2019
- Maxim Integrated Products, Inc.
- Jerome C. Bhat
- G01 - MEASURING TESTING
Information Patent Application
REDUCTION OF CHIPPING DAMAGE TO MEMS STRUCTURE
- Publication number 20150076631
- Publication date Mar 19, 2015
- InvenSense, Inc.
- Jongwoo SHIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Flexible multi-chip module and method of making the same
- Publication number 20050227412
- Publication date Oct 13, 2005
- Aptos Corporation
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for bubble-free application of a resin to a su...
- Publication number 20040134420
- Publication date Jul 15, 2004
- Aptos Corporation
- Kuolung Lei
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
FLAT-TOP BUMPING STRUCTURE AND PREPARATION METHOD
- Publication number 20040137707
- Publication date Jul 15, 2004
- Aptos Corporation
- Kuolung Lei
- H01 - BASIC ELECTRIC ELEMENTS

Kuolung (Dino) LEI

Person

Patents Grantslast 30 patents

Water proofing and water detection schemes for MEMS-based environme...

Water proofing and water detection schemes for MEMS-based environme...

Non-contact temperature measurement sensor

Non-contact temperature measurement sensor

Reduction of chipping damage to MEMS structure

Methods of packaging microelectromechanical resonators

Methods of forming packaged micro-electromechanical devices

Methods of forming multi-chip semiconductor substrates

Methods of forming microelectronic packaging substrates having thro...

Flexible multi-chip module and method of making the same

Flat-top bumping structure and preparation method

Patents Applicationslast 30 patents

WATER PROOFING AND WATER DETECTION SCHEMES FOR MEMS-BASED ENVIRONME...

WATER PROOFING AND WATER DETECTION SCHEMES FOR MEMS-BASED ENVIRONME...

NON-CONTACT TEMPERATURE MEASUREMENT SENSOR

REDUCTION OF CHIPPING DAMAGE TO MEMS STRUCTURE

Flexible multi-chip module and method of making the same

Apparatus and method for bubble-free application of a resin to a su...

FLAT-TOP BUMPING STRUCTURE AND PREPARATION METHOD